FujiFilm FinePix S1800 Series, Service Manual

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RoHS lead-free compliance
Confidential: FUJIFILM Service Center Use Only
With the exception of parts and materials expressly excluded from the RoHS directive, all the internal connections and
component parts and materials used in this product are lead-free compliant under the European RoHS directive (*1). Use the
designated after-sales parts and the designated lead-free solder when performing repairs.
*1: Definition of lead-free
A lead content ratio of 0.1 wt% or less in the applicable locations (solder, terminals, electronic components, etc.)
<Lead-free soldering>
When lead-free solder is used, the solder tends to be less workable than when eutectic solder is used. When carrying out
repairs, use a designated lead-free solder, bearing in mind the differing work practices for eutectic solder and lead-free
solder.
■
Differences in the soldering work for lead-free and eutectic solder
Eutectic solder (Sn-Pb) Lead-freesolder(Sn-Ag-Cu)
Melting point 183
°
C 220
°
C
Soldering iron temperature 283
°
C 320
°
C
The bonding temperature that will
give the best bond strength.
Wetting Good Poor
Surface Gloss Matte
■
Recommended equipment
Solder type (Displayed symbol)
SnAgCu
Wire diameter 0.8mm
lead-free
■
Soldering iron maintenance
Because of the high soldering iron temperature in lead-free soldering, there is rapid carbonization of the flux adhering to
the tip of the soldering iron.
(1) Always cover the tip of the soldering iron with solder when it is not being used.
(2) If the tip is black from carbonization, wipe it gently with a paper towel soaked in alcohol until the solder will wet.
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