Ericsson Internal
PRODUCT SPEC.
2 (4)
Prepared (also subject responsible if other)
No.
EAB/FJB/GM Peter Schurmann
5/1301-BMR 464 0002 Uen
Approved
Checked
Date
Rev
Reference
EAB/FJB/GM [Ksenia Harrisen]
See §1
2013-10-31
B
Template rev. J
Soldering Information - Hole Mounting
(Laydown
version)
The hole mounted product is intended for plated through hole
mounting by wave or manual soldering. The pin temperature is
specified to maximum to 270°C for maximum 10 seconds.
A maximum preheat rate of 4°C/s and maximum preheat
temperature of 150°C is suggested. When soldering by hand,
care should be taken to avoid direct contact between the hot
soldering iron tip and the pins for more than a few seconds in
order to prevent overheating.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
Delivery Package Information
(Laydown version)
The products are delivered in antistatic carrier tape
(EIA 481 standard).
Carrier Tape Specifications
Material
Antistatic PS
Surface resistance
<10
7
Ohm/square
Bakeability
The tape is not bakable
Tape width, W
56 mm [2.20 inch]
Pocket pitch, P
1
32 mm [1.26 inch]
Pocket depth, K
0
13 mm [0.51 inch]
Reel diameter
381 mm [15 inch]
Reel capacity
130 products /reel
Reel weight
1.8 kg/full reel
BMR4
6
series
PoL Regulators
Input 4.5-14 V, Output up to 50 A / 165 W
1/28701-BMR 464 Rev.B
July 2019
© Flex
Technical Specification
BMR4
6
series
PoL Regulators
Input
4.5-14
V, Output up to
50
A
/
165
W
1/28701-BMR 464 Rev.B
July 2019
©
Flex
Technical Specification
75