Ericsson Internal
PRODUCT SPEC.
1 (4)
Prepared (also subject responsible if other)
No.
EAB/FJB/GM Peter Schurmann
5/1301-BMR 464 0002 Uen
Approved
Checked
Date
Rev
Reference
EAB/FJB/GM [Ksenia Harrisen]
See §1
2013-10-31
B
Template rev. J
Soldering Information - Surface Mounting and Hole
Mount
ing
through Pin in Paste Assembly
(Laydown
version)
The product is intended for forced convection or vapor phase
reflow soldering in SnPb or Pb-free processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PWB and it is also recommended
to minimize the time in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
General reflow process specifications
SnPb eutectic
Pb-free
Average ramp-up (T
PRODUCT
)
3°C/s max
3°C/s max
Typical solder melting (liquidus)
temperature
T
L
183°C
221°C
Minimum reflow time above T
L
60 s
60 s
Minimum pin temperature
T
PIN
210°C
235°C
Peak product temperature
T
PRODUCT
225°C
260°C
Average ramp-down (T
PRODUCT
)
6°C/s max
6°C/s max
Maximum time 25°C to peak
6 minutes
8 minutes
T
PRODUCT
maximum
T
PIN
minimum
Time
Pin
profile
Product
profile
T
L
Time in
reflow
Time in preheat
/ soak zone
Time 25°C to peak
Temperature
Minimum Pin Temperature Recommendations
Pin number 2B is chosen as reference location for the
minimum pin temperature recommendation since this will likely
be the coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
PIN
) in excess
of the solder melting temperature, (T
L
, 183°C for Sn63Pb37) for
more than 60 seconds and a peak temperature of 220°C is
recommended to ensure a reliable solder joint.
For dry packed products only: depending on the type of solder
paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be used,
if the products are kept in a controlled environment (dry pack
handling and storage) prior to assembly.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN
) in
excess of the solder melting temperature (T
L
, 217 to 221°C for
SnAgCu solder alloys) for more than 60 seconds and a peak
temperature of 245°C on all solder joints is recommended to
ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PWB near pin 10B is chosen as reference
location for the maximum (peak) allowed product temperature
(T
PRODUCT
) since this will likely be the warmest part of the
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT
must not exceed 225 °C at any time.
Pb-free solder processes
For Pb-free solder processes, the product is qualified for MSL 3
according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT
must not exceed 260 °C at any time.
Dry Pack Information
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case the
products have been stored in an uncontrolled environment and
no longer can be considered dry, the modules must be baked
according to J-STD-033.
Thermocoupler Attachment
Pin 10B for measurement of maximum
Product temperature T
PRODUCT
Pin 2B for measurement of minimum Pin (solder joint)
temperature T
PIN
BMR4
6
series
PoL Regulators
Input 4.5-14 V, Output up to 50 A / 165 W
1/28701-BMR 464 Rev.B
July 2019
© Flex
Technical Specification
BMR4
6
series
PoL Regulators
Input
4.5-14
V, Output up to
50
A
/
165
W
1/28701-BMR 464 Rev.B
July 2019
©
Flex
Technical Specification
74
