CPC505
C P C 5 0 5 U s e r M a n u a l
54
© 2 0 2 2 F a s t w e l v . 0 0 1
ANNEX A
RIO587 Rear I/O Module
A.1 Introduction
The RIO587 I/O module is designed for use with the CPC505 board (CompactPCI format, 6U form
factor). The RIO587 ensures access to the CPC505 interfaces on J3
– J5 CPCI connectors when
installed from the reverse side of the backplane.
One important advantage of this method of mounting the expansion board is that fewer or no
cables can be connected to the motherboard, which makes it easier to install and remove the
processor board from the system enclosure.
The module is implemented in the CPCI 6U RIO design in two versions: RIO587-01 (4HP height)
and RIO587-02 (8HP height). Depending on the version, the set of interfaces displayed on the rear
panel differs.
The RIO587 is compatible with the PICMG 2.0 Compact PCI r.3.0 standard. It is installed at the
back of the system chassis opposite the CPC505 CPU card in the corresponding backplane slot.
A.2 RIO587 versions
The differences of the configurations delivered are summarized in the table:
Table A-1
– RIO587 versions
#
Version
Module height
1
RIO587-01
4HP
2
RIO587-02
8HP
Descriptions of the configurations delivered:
RIO587-01 - CPCI 6U RIO module with 4HP height and interfaces PS/2, RS-232, 2 x RS-485, 2 x
USB2.0, 2 x 10/100/1000 Mb Ethernet, CFast, support of Innodisk SATADOM.
RIO587-02 - CPCI 6U RIO module with 8HP height and interfaces PS/2, 4 RS-232, 2 x RS-485, 2
x USB2.0, 2 x 10/100/1000 Mb Ethernet, CFast, HDD 2.5" SATA.
Table A-2 - RIO587 temperature range (industrial and commercial version)
Characteristics
Industrial version RIO587-0x-I
Commercial version RIO587-0x-C
Low temperature
- 40
°С
0
°С
High temperature
+ 85
°С
+70
°С
If the board has a conformal coating (\Coated option), the modules are resistant to cyclic damp
heat at ambient temperature of + (55
±2) °C, relative humidity (93±3)%.
The weight of the modules for the versions RIO587-01 and RIO587-02 is shown in the table below:
