163
Applies to
1
Parameter
Conditions
Min
Max
Units
Ambient air temperature
0 [32] 55 [131] °C [°F]
Ambient air humidity
Non-condensing
10
90
% RH
WARNING
The thermal design of the host PC must ensure that, at any time, the FPGA die
temperature never exceeds the recommended limit.
WARNING
Exceeding the upper limit of the FPGA die temperature can permanently
damage the card.
NOTE
For PCIe/104 products only, the ambient air temperature specification applies
to any point in the vicinity of the module including the gap between modules
of the PCIe/104 stack.
1
1625 DB25F I/O Adapter Cable
,
1636 InterPC C2C-Link Adapter
,
3300 HD26F I/O module for
Coaxlink Duo PCIe/104
,
3301 Thermal drain (Model 1) for Coaxlink Duo PCIe/104
,
3302
DIN1.0/2.3 Coaxial cable for Coaxlink Duo PCIe/104
,
3303 C2C-Link Ribbon Cable
,
3304
HD26F I/O Adapter Cable
,
3610 HD26F I/O Extension Module TTL-RS422
,
3612 HD26F I/O
Extension Module TTL-CMOS5V-RS422
,
3613 JTAG Adapter Xilinx for Coaxlink
,
3614 HD26F
I/O Extension Module - Standard I/O Set
,
3617 HD26F I/O Extension Module TTL-CMOS5V
and
3618 HD26F I/O Extension Module - Fast I/O
.
Coaxlink
Hardware Manual
