23 BASIC EXTERNAL CONNECTION DIAGRAM
S1C17F13 TeChniCal Manual
Seiko epson Corporation
23-1
(Rev. 1.0)
Basic External Connection Diagram
23
DCLK
DSIO
DST2
P
xx
I/O
S1C17F13
[The potential of the substrate
(back of the chip) is V
SS
.]
Active matrix EPD panel
R
DBG
ICDmini
V
DD
(
)
∗
1 When the Flash voltage booster is used
∗
2 When the Flash voltage booster is not used
PIOA0
PIOA7
PIOD0
PIOD7
#PIOCE
#PIORD
#PIOWR
SDI1
SDO1
SPICLK1
P23(#SPISS1)
V
DD
V
DD (Pin 18)
V
D1
V
OSC
C1P
C1N
C1H
C2P
C2N
V
PP
OSC1
OSC2
OSC3
OSC4
#RESET
TEST
V
SS
SENB1
SENA1
REF1
RFIN1
VM1
VM2
IREF_M
C1P
C1N
C1H
C2P
C2N
V
PP
C
PW2
C
PW3
C
PW4
C
PW5
C
PW6
C
PW7
R
TMP2
R
TMP1
R
REF
C
REF
C
D1
C
G1
X'tal1
C
D3
C
G3
X'tal3/
CR3
OPEN
∗
1
+
+
C
PW1-1
C
PW1-2
C
PW1-3
2.0–3.6 V
∗
2
OPEN
Sample external parts
Symbol
Name
Recommended parts
C
PW1-1
Bypass capacitor between V
DD
–V
SS
Electrolytic capacitor
C
PW1-2
Capacitor between V
DD
–V
SS
Electrolytic capacitor (Place as closer to V
DD
(pin 18) as possible.)
C
PW1-3
Capacitor between V
DD
–V
SS
Ceramic capacitor (Place as closer to V
DD
(pin 18) as possible.)
C
PW2
V
D1
stabilization capacitor
Ceramic capacitor
C
PW3
V
OSC
stabilization capacitor
Ceramic capacitor
C
PW4
–
6
Flash power supply voltage boosting capacitors Ceramic capacitor
C
PW7
V
PP
stabilization capacitor
Ceramic capacitor
R
DBG
DSIO pull-up resistor
Thick film chip resistor
R
REF
RFC reference resistor
Thick film chip resistor
R
TMP1
,
2
Resistive sensors
Temperature sensor 103AP-2 manufactured by SEMITEC Corporation
Humidity sensor C15-M53R manufactured by SHINYEI Technology Co.,Ltd.
(
*
In AC oscillation mode for resistive sensor measurements)
C
REF
RFC oscillating capacitor
Ceramic capacitor
*
For recommended component values, refer to “Recommended Operating Conditions” in the “Electrical Characteristics” chapter.
The C
G1
, C
D1
, C
G3
, and C
D3
capacitance values should be determined after performing matching evaluation of the resonator
mounted on the printed circuit board actually used.