C
MVME51005E Single Board Computer Installation and Use (6806800A38B)
89
C
Thermal Analysis
Ambient temperature, air flow, board electrical operation and software operation affect board
component temperatures. To evaluate the thermal performance of a circuit board assembly, you
should test the board under actual operating conditions. These operating conditions vary
depending on system design.
A thermal analysis was performed in a representative system to verify operation within specified
ranges. Refer to
Table A-1
in
Appendix A, Specifications
. You should evaluate the thermal
performance of the board in your application.
This appendix gives systems integrators the information necessary to conduct thermal
evaluations of the board in their specific system configuration. It identifies thermally significant
components and lists the corresponding maximum allowable component operating
temperatures. It also provides example procedures for component-level temperature
measurements.
Thermally Significant Components
Table C-1
summarizes components that show significant temperature rises. You should monitor
these components to assess thermal performance.
Table C-1
also supplies the component
reference designator and the maximum allowable operating temperature.
You can find components on the board by their reference designators. Refer to
Figure C-1
and
Figure C-2
.
The preferred temperature measurement location for a component may be:
❏
junction - refers to the temperature measured by an on-chip thermal device
❏
case - refers to the temperature at the top, center surface of the component
