PC6-TANGO • CompactPCI
®
PlusIO • Intel® Atom™ E39xx Processor (APL-I SoC)
Thermal Considerations
The PC6-TANGO is equipped with a passive heatsink. Its height takes into account the 4HP envelope
of a CompactPCI
®
board. Dependent on the targeted APL-I SoC SKU and ambient temperature, many
applications may not require additional cooling.
However, a reasonable forced vertical airflow through the system enclosure (e.g. bottom mount fan
unit) may be required for demanding applications and for higher ambient temperatures. The
maximum temperature on top of the CPU case must not exceed 100°C e.g. for the E3940.
The APL E3900 Atom
TM
processors support Intel's Enhanced SpeedStep® technology, enabling
dynamic switching between multiple core voltages and frequencies depending on core temperature
and currently required performance. The processors are able to reduce their core speed and core
voltage in multiple steps down. Additionally a reduction of the graphics core clock and voltage is
possible. This results in a reduction of power consumption and heat dissipation.
Do not try to remove the PC6-TANGO heatsink by yourself, since it is bonded to the CPU by a
Phase-Change-Material (PCM), in order to improve the heat flow between the APL and the heatsink.
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