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26
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WaveRIDER
®
WaveRIDER Parameter (3)
Problem (1)
A36-9283-06 Rev
1.2
Solder W
av
e Contac
t Lengths
(A, B, C)
Solder Wav
e Dwell Times
(A, B, C)
Chip W
av
e Contac
t Lengths
(A, B, C)
Chip Wav
e Dwell Times
(A, B, C)
Conv
ey
or Speed
Pote
ntia
l C
a
us
e
(2
)
Solder Bridges
Conveyor speed too fast….Reduces dwell time in wave and forces preheat to be to high
3
Preheat temp low….Solder pads not within 100°F of solder wave temperature
3
1
2
1
2
3
Conveyor speed too low….increases dwell time in solder wave
3
Carrier bent or damaged….Board must run parallel (flat) over wave
3
Conveyor fingers bent….Board may not be parallel over solder wave
2
Flux applied is insufficient….Spotty application or weak activity flux
2
Rails not parallel (flat) over nozzles….One side of board deeper in solder wave than the other
2
Wave or nozzles not level….Must be parallel to conveyor
1
Wave height/exit incorrectly set….Exit speed of solder should match conveyor speed
3
Board not run in best direction….Component shadowing
1
Dross recirculating from pot to wave….Excessive dross build up
1
Air knife after wave set incorrectly….Air knife not effectively blowing off excess solder
1
< 0.3 s
e
c
0.062
2.0 inc
hes
3 s
ec
495°F
100°F
< 0.3 s
e
c
.062 inc
hes
0.5 inc
hes
1 s
ec
495°F
N/A
4 ft/Min
5°F/Sec
Room Temp
225°F
3 = High Impac
t
2 = Moderate Impac
t
1 = Low Impac
t
Typical Values
Figure 3- 6: Troubleshooting Process
