ADSP21477KCPZ-1A (IC1401)
ADSP-21477
/
ADSP-21478
/
ADSP-21479
Rev. C | Page 73 of 76 | July 2013
OUTLINE DIMENSIONS
The processors are available in 88-lead LFCSP_VQ, 100-lead
LQFP_EP and 196-ball CSP_BGA RoHS compliant packages.
For package assignment by model, see
Ordering Guide on
Page 76
.
Figure 57. 88-Lead Lead Frame Chip Scale Package [LFCSP_VQ
1
]
(CP-88-5)
Dimensions Shown in Millimeters
1
For information relating to the exposed pad on the CP-88-5 package, see the table endnote
on Page 68
.
*COMPLIANT TO JEDEC STANDARDS MO-220-VRRD
EXCEPT FOR MINIMUM THICKNESS AND LEAD COUNT.
1
22
66
45
23
44
88
67
0.50
0.40
0.30
0.30
0.23
0.18
10.50
REF
0.60 MAX
0.60
MAX
6.70
REF SQ
0.50
BSC
0.138~0.194 REF
12° MAX
SEATING
PLANE
TOP VIEW
EXPOSED PAD
BOTTOM VIEW
0.70
0.65
0.60
0.045
0.025
0.005
PIN 1
INDICATOR
12.10
12.00 SQ
11.90
11.85
11.75 SQ
11.65
PIN 1
INDICATOR
*0.90
0.85
0.75
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
Rev. C | Page 68 of 76 | July 2013
ADSP-21477
/
ADSP-21478
/
ADSP-21479
88-LFCSP_VQ LEAD ASSIGNMENT
Table 61
lists the 88-Lead LFCSP_VQ package lead names.
Table 61. 88-Lead LFCSP_VQ Lead Assignments (Numerical by Lead Number)
Lead Name
Lead No.
Lead Name
Lead No.
Lead Name
Lead No.
Lead Name
Lead No.
CLK_CFG1
1
V
DD_EXT
23
DAI_P10
45
V
DD_INT
67
BOOT_CFG0
2
DPI_P08
24
V
DD_INT
46
FLAG0
68
V
DD_EXT
3
DPI_P07
25
V
DD_EXT
47
V
DD_INT
69
V
DD_INT
4
DPI_P09
26
DAI_P20
48
FLAG1
70
BOOT_CFG1
5
DPI_P10
27 V
DD_INT
49
FLAG2
71
GND
6
DPI_P11
28 DAI_P08
50
FLAG3
72
CLK_CFG0
7
DPI_P12
29 DAI_P04
51
GND
73
V
DD_INT
8
DPI_P13
30
DAI_P14
52
GND
74
CLKIN
9
DAI_P03
31
DAI_P18
53
V
DD_EXT
75
XTAL
10
DPI_P14
32
DAI_P17
54
GND
76
V
DD_EXT
11
V
DD_INT
33 DAI_P16
55
V
DD_INT
77
V
DD_INT
12
DAI_P13
34
DAI_P15
56
TRST
78
V
DD_INT
13
DAI_P07
35
DAI_P12
57
EMU
79
RESETOUT/RUNRSTIN 14
DAI_P19
36
DAI_P11
58
TDO
80
V
DD_INT
15
DAI_P01
37
V
DD_INT
59
V
DD_EXT
81
DPI_P01
16
DAI_P02
38
GND
60
V
DD_INT
82
DPI_P02
17
V
DD_INT
39
THD_M
61
TDI
83
DPI_P03
18 V
DD_EXT
40
THD_P
62 TCK
84
V
DD_INT
19
V
DD_INT
41
V
DD_THD
63
V
DD_INT
85
DPI_P05
20
DAI_P06
42
V
DD_INT
64
RESET
86
DPI_P04
21
DAI_P05
43
V
DD_INT
65
TMS
87
DPI_P06
22
DAI_P09
44
V
DD_INT
66
V
DD_INT
88
GND
89*
* Lead no. 89 is the GND supply (see
Figure 53
and
Figure 54
) for the processor; this pad must be
robustly
connected to GND in order for the
processor to function.
64