Cypress Semiconductor CY7C1460AV33, Specification Sheet

Page: 18 / 27

CY7C1460AV33
CY7C1462AV33
CY7C1464AV33
Document #: 38-05353 Rev. *D Page 18 of 27
Note:
17. Tested initially and after any design or process changes that may affect these parameters.
Capacitance
[17]
Parameter Description Test Conditions
100 TQFP
Max.
165 FBGA
Max.
209 FBGA
Max. Unit
C
IN
Input Capacitance T
A
= 25
°
C, f = 1 MHz,
V
DD
= 2.5V V
DDQ
= 2.5V
6.5 7 5 pF
C
CLK
Clock Input Capacitance 3 7 5 pF
C
I/O
Input/Output Capacitance 5.5 6 7 pF
Thermal Resistance
[17]
Parameters Description Test Conditions
100 TQFP
Package
165 FBGA
Package
209 FBGA
Package Unit
Θ
JA
Thermal Resistance
(Junction to Ambient) Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51. 25.21 20.8 25.31
°
C/W
Θ
JC
Thermal Resistance
(Junction to Case) 2.28 3.2 4.48
°
C/W
AC Test Loads and Waveforms
OUTPUT
R = 317
Ω
R = 351
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
3.3V I/O Test Load
OUTPUT
R = 1667
Ω
R =1538
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
2.5V I/O Test Load
[+] Feedback