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CY7C1460AV33
CY7C1462AV33
CY7C1464AV33

Document #: 38-05353 Rev. *D

Page 11 of 27

When the TAP controller is in the Capture-IR state, the two
least significant bits are loaded with a binary “01” pattern to
allow for fault isolation of the board-level serial test data path.

Bypass Register

To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between the
TDI and TDO balls. This allows data to be shifted through the
SRAM with minimal delay. The bypass register is set LOW
(V

SS

) when the BYPASS instruction is executed.

Boundary Scan Register

The boundary scan register is connected to all the input and
bidirectional balls on the SRAM. The length of the Boundary
Scan Register for the SRAM in different packages is listed in
the Scan Register Sizes table.

The boundary scan register is loaded with the contents of the
RAM I/O ring when the TAP controller is in the Capture-DR
state and is then placed between the TDI and TDO balls when
the controller is moved to the Shift-DR state. The EXTEST,
SAMPLE/PRELOAD and SAMPLE Z instructions can be used
to capture the contents of the I/O ring.

The Boundary Scan Order tables show the order in which the
bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSB of the register is connected
to TDI, and the LSB is connected to TDO.

Identification (ID) Register

The ID register is loaded with a vendor-specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired
into the SRAM and can be shifted out when the TAP controller
is in the Shift-DR state. The ID register has a vendor code and
other information described in the Identification Register
Definitions table.

TAP Instruction Set

Overview

Eight different instructions are possible with the three bit
instruction register. All combinations are listed in the
Instruction Codes table. Three of these instructions are listed
as RESERVED and should not be used. The other five instruc-
tions are described in detail below.

Instructions are loaded into the TAP controller during the
Shift-IR state when the instruction register is placed between
TDI and TDO. During this state, instructions are shifted
through the instruction register through the TDI and TDO balls.
To execute the instruction once it is shifted in, the TAP
controller needs to be moved into the Update-IR state.

IDCODE

The IDCODE instruction causes a vendor-specific, 32-bit code
to be loaded into the instruction register. It also places the
instruction register between the TDI and TDO balls and allows
the IDCODE to be shifted out of the device when the TAP
controller enters the Shift-DR state.

The IDCODE instruction is loaded into the instruction register
upon power-up or whenever the TAP controller is given a test
logic reset state.

SAMPLE Z

The SAMPLE Z instruction causes the boundary scan register
to be connected between the TDI and TDO pins when the TAP
controller is in a Shift-DR state. The SAMPLE Z command puts
the output bus into a High-Z state until the next command is
given during the “Update IR” state.

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the inputs and output pins is
captured in the boundary scan register. 

The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because
there is a large difference in the clock frequencies, it is
possible that during the Capture-DR state, an input or output
will undergo a transition. The TAP may then try to capture a
signal while in transition (metastable state). This will not harm
the device, but there is no guarantee as to the value that will
be captured. Repeatable results may not be possible.

To guarantee that the boundary scan register will capture the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller's capture set-up plus
hold times (t

CS

 and t

CH

). The SRAM clock input might not be

captured correctly if there is no way in a design to stop (or
slow) the clock during a SAMPLE/PRELOAD instruction. If this
is an issue, it is still possible to capture all other signals and
simply ignore the value of the CK and CK# captured in the
boundary scan register.

Once the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the
boundary scan register between the TDI and TDO pins.

PRELOAD allows an initial data pattern to be placed at the
latched parallel outputs of the boundary scan register cells
prior to the selection of another boundary scan test operation.

The shifting of data for the SAMPLE and PRELOAD phases
can occur concurrently when required—that is, while data
captured is shifted out, the preloaded data can be shifted in.

BYPASS

When the BYPASS instruction is loaded in the instruction
register and the TAP is placed in a Shift-DR state, the bypass
register is placed between the TDI and TDO pins. The
advantage of the BYPASS instruction is that it shortens the
boundary scan path when multiple devices are connected
together on a board.

EXTEST

The EXTEST instruction enables the preloaded data to be
driven out through the system output pins. This instruction also
selects the boundary scan register to be connected for serial
access between the TDI and TDO in the shift-DR controller
state.

EXTEST OUTPUT BUS TRI-STATE

IEEE Standard 1149.1 mandates that the TAP controller be
able to put the output bus into a tri-state mode. 

The boundary scan register has a special bit located at bit #89
(for 165-FBGA package) or bit #138 (for 209-FBGA package).

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Summary of Contents for CY7C1460AV33

Page 1: ...required to enable consecutive Read Write operations with data being trans ferred on every clock cycle This feature dramatically improves the throughput of data in systems that require frequent Write...

Page 2: ...am CY7C1462AV33 2M x 18 A0 A1 A C MODE CE1 CE2 CE3 OE READ LOGIC DQs DQPa DQPb DQPc DQPd DQPe DQPf DQPg DQPh D A T A S T E E R I N G O U T P U T B U F F E R S MEMORY ARRAY E E INPUT REGISTER0 ADDRESS...

Page 3: ...1460AV33 100 pin TQFP Pinout A A A A A 1 A 0 V SS V DD A A A A A A A NC NC VDDQ VSS NC DQPa DQa DQa VSS VDDQ DQa DQa VSS NC VDD DQa DQa VDDQ VSS DQa DQa NC NC VSS VDDQ NC NC NC NC NC NC VDDQ VSS NC NC...

Page 4: ...VDD NC VDD DQa VDD VDDQ DQa VDDQ VDD VDD VDDQ VDD VDDQ DQa VDDQ A A VSS A A A DQb DQb DQb ZZ DQa DQa DQPa DQa A VDDQ A 2 3 4 5 6 7 1 A B C D E F G H J K L M N P R TDO NC 576M NC 1G NC NC DQPb NC DQb...

Page 5: ...er is advanced When LOW a new address can be loaded into the device for an access After being deselected ADV LD should be driven LOW in order to load a new address Pin Configurations continued A B C D...

Page 6: ...g the data portion of a write sequence during the first clock when emerging from a deselected state and when the device is deselected regardless of the state of OE DQPa DQPb DQPc DQPd DQPe DQPf DQPg D...

Page 7: ...h burst counters use A0 and A1 in the burst sequence and will wrap around when incre mented sufficiently A HIGH input on ADV LD will increment the internal burst counter regardless of the state of chi...

Page 8: ...ZZS Device operation to ZZ ZZ VDD 0 2V 2tCYC ns tZZREC ZZ recovery time ZZ 0 2V 2tCYC ns tZZI ZZ active to sleep current This parameter is sampled 2tCYC ns tRZZI ZZ Inactive to exit sleep current This...

Page 9: ...e Byte b DQb and DQPb L H H L H Write Bytes b a L H H L L Write Byte c DQc and DQPc L H L H H Write Bytes c a L H L H L Write Bytes c b L H LL L H Write Bytes c b a L H L L L Write Byte d DQd and DQPd...

Page 10: ...e unconnected if the TAP is unused in an application TDI is connected to the most signif icant bit MSB of any register See Tap Controller Block Diagram Test Data Out TDO The TDO output ball is used to...

Page 11: ...p or whenever the TAP controller is given a test logic reset state SAMPLE Z The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO pins when the TAP control...

Page 12: ...e TAP controller is in the Test Logic Reset state Reserved These instructions are not implemented but are reserved for future use Do not use these instructions TAP Timing TAP AC Switching Characterist...

Page 13: ...V VDDQ 2 5V 2 1 V VOL1 Output LOW Voltage IOL 8 0 mA VDDQ 3 3V 0 4 V IOL 1 0 mA VDDQ 2 5V 0 4 V VOL2 Output LOW Voltage IOL 100 A VDDQ 3 3V 0 2 V VDDQ 2 5V 0 2 V VIH Input HIGH Voltage VDDQ 3 3V 2 0...

Page 14: ...the vendor ID code and places the register between TDI and TDO This operation does not affect SRAM operations SAMPLE Z 010 Captures I O ring contents Places the boundary scan register between TDI and...

Page 15: ...5 P8 30 E10 55 B1 80 R2 6 R8 31 D10 56 A1 81 P3 7 R9 32 C11 57 C1 82 R3 8 P9 33 A11 58 D1 83 P2 9 P10 34 B11 59 E1 84 R4 10 R10 35 A10 60 F1 85 P4 11 R11 36 B10 61 G1 86 N5 12 H11 37 A9 62 D2 87 P6 13...

Page 16: ...12 U9 47 10F 82 4B 117 1P 13 P6 48 10E 83 3C 118 2R 14 W11 49 11E 84 3B 119 1R 15 W10 50 11D 85 3A 120 2T 16 V11 51 10D 86 2A 121 1T 17 V10 52 11C 87 1A 122 2U 18 U11 53 10C 88 2B 123 1U 19 U10 54 11...

Page 17: ...or 2 5V I O IOL 1 0 mA 0 4 V VIH Input HIGH Voltage 15 for 3 3V I O 2 0 VDD 0 3V V for 2 5V I O 1 7 VDD 0 3V V VIL Input LOW Voltage 15 for 3 3V I O 0 3 0 8 V for 2 5V I O 0 3 0 7 V IX Input Leakage C...

Page 18: ...scription Test Conditions 100 TQFP Package 165 FBGA Package 209 FBGA Package Unit JA Thermal Resistance Junction to Ambient Test conditions follow standard test methods and procedures for measuring th...

Page 19: ...ip Select Set up 1 2 1 4 1 5 ns Hold Times tAH Address Hold After CLK Rise 0 3 0 4 0 5 ns tDH Data Input Hold After CLK Rise 0 3 0 4 0 5 ns tCENH CEN Hold After CLK Rise 0 3 0 4 0 5 ns tWEH WE BWx Hol...

Page 20: ...the Burst sequence is determined by the status of the MODE 0 Linear 1 Interleaved Burst operations are optional WRITE D A1 1 2 3 4 5 6 7 8 9 CLK t CYC tCL tCH 10 CE tCEH tCES WE CEN tCENH tCENS BWx AD...

Page 21: ...ditions to deselect the device 29 I Os are in High Z when exiting ZZ sleep mode NOP STALL and DESELECT Cycles 24 25 27 ZZ Mode Timing 28 29 Switching Waveforms continued READ Q A3 4 5 6 7 8 9 10 CLK C...

Page 22: ...0AV33 167BZXI 51 85165 165 ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Lead Free CY7C1462AV33 167BZXI CY7C1464AV33 167BGI 51 85167 209 ball Fine Pitch Ball Grid Array 14 22 1 76 mm CY7C1464AV33 1...

Page 23: ...Y7C1460AV33 250AXI 51 85050 100 Pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free Industrial CY7C1462AV33 250AXI CY7C1460AV33 250BZI 51 85165 165 ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm CY7C...

Page 24: ...SIDE 3 DIMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20 1 40 0 05 12 1 1 60 MAX 0 05 MIN 0 60 0 15 0 MIN 0 25 0...

Page 25: ...00 1 00 0 45 0 05 165X 0 25 M C A B 0 05 M C B A 0 15 4X 0 35 1 40 MAX SEATING PLANE 0 53 0 05 0 25 C 0 15 C PIN 1 CORNER TOP VIEW BOTTOM VIEW 2 3 4 5 6 7 8 9 10 10 00 14 00 B C D E F G H J K L M N 11...

Page 26: ...n express written agreement with Cypress Furthermore Cypress does not authorize its products for use as critical components in life support systems where a malfunction or failure may reasonably be exp...

Page 27: ...o 1 5 ns for 200 MHz Speed Bin Added lead free information for 100 pin TQFP and 165 FBGA and 209 BGA packages B 331778 See ECN SYT Modified Address Expansion balls in the pinouts for 165 FBGA and 209...

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