Cypress Semiconductor CY7C1361C Specification Sheet Download Page 27

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CY7C1361C
CY7C1363C

Document #: 38-05541 Rev. *F

Page 27 of 31

100

CY7C1361C-100AXC

51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

(3 Chip Enable)

Commercial

CY7C1363C-100AXC

CY7C1361C-100AJXC

51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

(2 Chip Enable)

CY7C1363C-100AJXC

CY7C1361C-100BGC

51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm)

CY7C1363C-100BGC

CY7C1361C-100BGXC

51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free

CY7C1363C-100BGXC

CY7C1361C-100BZC

51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

CY7C1363C-100BZC

CY7C1361C-100BZXC

51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free

CY7C1363C-100BZXC

CY7C1361C-100AXI

51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

(3 Chip Enable)

lndustrial

CY7C1363C-100AXI

CY7C1361C-100AJXI

51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

(2 Chip Enable)

CY7C1363C-100AJXI

CY7C1361C-100BGI

51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm)

CY7C1363C-100BGI

CY7C1361C-100BGXI

51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free

CY7C1363C-100BGXI

CY7C1361C -100BZI

51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

CY7C1363C-100BZI

CY7C1361C-100BZXI

51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free

CY7C1363C-100BZXI

100

CY7C1361C-100AXE

51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

Automotive

Ordering Information

(continued)

Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or

visit

www.cypress.com

for actual products offered.

Speed

(MHz)

Ordering Code

Package
Diagram

Part and Package Type

Operating

Range

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Summary of Contents for CY7C1361C

Page 1: ...positive edge triggered Clock Input CLK The synchronous inputs include all addresses all data inputs address pipelining Chip Enable CE1 depth expansion Chip Enables CE2 and CE3 2 Burst Control inputs...

Page 2: ...EGISTER BYTE WRITE REGISTER DQD DQPD BYTE WRITE REGISTER DQD DQPD BYTE WRITE REGISTER DQC DQPC BYTE WRITE REGISTER DQB DQPB BYTE WRITE REGISTER DQA DQPA BYTE WRITE REGISTER Logic Block Diagram CY7C136...

Page 3: ...60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 MODE CY7C1361C 256K x 36 VSS DNU A A A A A 1 A 0 NC NC V SS V DD NC A A A A A A A A A NC NC VDDQ VSSQ NC DQPA...

Page 4: ...61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 MODE CY7C1361C 256K x 36 VSS DNU A A A A A 1 A 0 NC NC V SS V DD A A A A A A A A NC NC VDDQ VSSQ NC DQPA...

Page 5: ...C NC CE1 OE ADV GW VSS VSS VSS VSS VSS VSS VSS VSS DQPA MODE DQPD DQPB BWB BWC NC VDD NC BWA NC BWE BWD ZZ 2 3 4 5 6 7 1 A B C D E F G H J K L M N P R T U VDDQ NC 288M NC 144M NC DQB DQB DQB DQB A A A...

Page 6: ...C DQA DQA VDD VDDQ VDD VDDQ DQB VDD NC VDD DQA VDD VDDQ DQA VDDQ VDD VDD VDDQ VDD VDDQ DQA VDDQ A A VSS A A A DQB DQB DQB ZZ DQA DQA DQPA DQA A VDDQ A CY7C1363C 512K x 18 A0 A VSS 2 3 4 5 6 7 1 A B C...

Page 7: ...from Processor sampled on the rising edge of CLK active LOW When asserted LOW addresses presented to the device are captured in the address registers A 1 0 are also loaded into the burst counter When...

Page 8: ...VDD through a pull up resistor This pin is not available on TQFP packages TMS JTAG serial input Synchronous Serial data In to the JTAG circuit Sampled on the rising edge of TCK If the JTAG feature is...

Page 9: ...appropriate data will be latched and written into the device Byte writes are allowed All I Os are tri stated during a byte write Since this is a common I O device the asynchronous OE input signal must...

Page 10: ...H H L H Tri state Read Cycle Continue Burst Next H X X L X H L H L L H Q Read Cycle Continue Burst Next H X X L X H L H H L H Tri state Write Cycle Continue Burst Next X X X L H H L L X L H D Write Cy...

Page 11: ...DQPA H L L H H L Write Bytes D B DQPD DQPA H L L H L H Write Bytes D B A DQPD DQPB DQPA H L L H L L Write Bytes D B DQPD DQPB H L L L H H Write Bytes D B A DQPD DQPC DQPA H L L L H L Write Bytes D C...

Page 12: ...rnally resulting in a logic HIGH level Test Data In TDI The TDI ball is used to serially input information into the registers and can be connected to the input of any of the registers The register bet...

Page 13: ...hen the instruction register is placed between TDI and TDO During this state instructions are shifted through the instruction register through the TDI and TDO balls To execute the instruction once it...

Page 14: ...for future use Do not use these instructions TAP Timing TAP AC Switching Characteristics Over the Operating Range 9 10 Parameter Parameter Min Max Unit Clock tTCYC TCK Clock Cycle Time 50 ns tTF TCK C...

Page 15: ...1 V VOL1 Output LOW Voltage IOL 8 0 mA VDDQ 3 3V 0 4 V IOL 8 0 mA VDDQ 2 5V 0 4 V VOL2 Output LOW Voltage IOL 100 A VDDQ 3 3V 0 2 V VDDQ 2 5V 0 2 V VIH Input HIGH Voltage VDDQ 3 3V 2 0 VDD 0 3 V VDDQ...

Page 16: ...ode and places the register between TDI and TDO This operation does not affect SRAM operations SAMPLE Z 010 Captures I O ring contents Places the boundary scan register between TDI and TDO Forces all...

Page 17: ...0 M2 DQB 15 E7 DQB 51 L1 DQD 15 E7 DQA 51 L1 DQB 16 F6 DQB 52 K2 DQD 16 F6 DQA 52 K2 DQB 17 G7 DQB 53 Internal Internal 17 G7 DQA 53 Internal Internal 18 H6 DQB 54 H1 DQC 18 H6 DQA 54 H1 DQB 19 T7 ZZ...

Page 18: ...50 L1 DQB 15 D11 DQB 51 K1 DQD 15 D11 DQA 51 K1 DQB 16 E11 DQB 52 J1 DQD 16 E11 DQA 52 J1 DQB 17 F11 DQB 53 Internal Internal 17 F11 DQA 53 Internal Internal 18 G11 DQB 54 G2 DQC 18 G11 DQA 54 G2 DQB...

Page 19: ...I O 1 7 VDD 0 3V V VIL Input LOW Voltage 13 for 3 3V I O 0 3 0 8 V for 2 5V I O 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI VDDQ 5 5 A Input Current of MODE Input VSS 30 A Input VDD...

Page 20: ...on to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance per EIA JESD51 29 41 34 1 16 8 C W JC Thermal Resistance Junction to Case 6 31 14 0 3 0 C W AC...

Page 21: ...0 5 ns tADH ADSP ADSC Hold After CLK Rise 0 5 0 5 ns tWEH GW BWE BW A D Hold After CLK Rise 0 5 0 5 ns tADVH ADV Hold After CLK Rise 0 5 0 5 ns tDH Data Input Hold After CLK Rise 0 5 0 5 ns tCEH Chip...

Page 22: ...GH or CE2 is LOW or CE3 is HIGH tCYC tCL CLK tADH tADS ADDRESS t CH tAH tAS A1 tCEH tCES Data Out Q High Z tCLZ tDOH tCDV tOEHZ tCDV Single READ BURST READ tOEV tOELZ tCHZ Burst wraps around to its in...

Page 23: ...ADDRESS t CH tAH tAS A1 tCEH tCES High Z BURST READ BURST WRITE D A2 D A2 1 D A2 1 D A1 D A3 D A3 1 D A3 2 D A2 3 A2 A3 Extended BURST WRITE D A2 2 Single WRITE tADH tADS tADH tADS t OEHZ tADVH tADVS...

Page 24: ...is initiated by ADSP or ADSC 25 GW is HIGH Timing Diagrams continued tCYC t CL CLK tADH tADS ADDRESS t CH tAH tAS A2 tCEH tCES Single WRITE D A3 A3 A4 BURST READ Back to Back READs High Z Q A2 Q A4 Q...

Page 25: ...d when entering ZZ mode See Cycle Descriptions table for all possible signal conditions to deselect the device 27 DQs are in high Z when exiting ZZ sleep mode Timing Diagrams continued t ZZ I SUPPLY C...

Page 26: ...rid Array 14 x 22 x 2 4 mm Lead Free CY7C1363C 133BGXC CY7C1361C 133BZC 51 85180 165 ball Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm CY7C1363C 133BZC CY7C1361C 133BZXC 51 85180 165 ball Fine Pitch Ba...

Page 27: ...20 x 1 4 mm Lead Free 3 Chip Enable lndustrial CY7C1363C 100AXI CY7C1361C 100AJXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free 2 Chip Enable CY7C1363C 100AJXI CY7C1361C 100BGI 51 85...

Page 28: ...IMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20 1 40 0 05 12 1 1 60 MAX 0 05 MIN 0 60 0 15 0 MIN 0 25 0 7 8X STAN...

Page 29: ...K J U P N M T R 12 00 19 50 30 TYP 2 40 MAX A1 CORNER 0 70 REF U T R P N M L K J H G F E D C A B 2 1 4 3 6 5 7 1 00 3X REF 7 62 22 00 0 20 14 00 0 20 1 27 60 0 10 C 0 15 C B A 0 15 4X 0 05 M C 0 75 0...

Page 30: ...tion PowerPC is a trademark of IBM Corporation All product and company names mentioned in this document are the trademarks of their respective holders Package Diagrams continued A 1 PIN 1 CORNER 15 00...

Page 31: ...Jc for TQFP Package from 25 and 9 C W to 29 41 and 6 13 C W respectively Changed JA and Jc for BGA Package from 25 and 6 C W to 34 1 and 14 0 C W respectively Changed JA and Jc for FBGA Package from...

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