Copyright © 2008-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are registered trademarks and the Cree logo is a trademark of
Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty
information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor
endorsement, sponsorship or association.
6
XLamp
®
XR FamiLy LED SoLDERing & HanDLing
XLamp
®
XR FamiLy LED REFLoW soLDERing CHaRaCTERisTiCs
In testing, Cree has found XLamp XR family LEDs to be compatible with JEDEC J‑STD‑020C, using the parameters listed below. As a
general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder
paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
profile Feature
Lead-Free solder
Average ramp-Up rate (Ts
max
to Tp)
1.2 °C/second
Preheat: Temperature Min (Ts
min
)
120 °C
Preheat: Temperature Max (Ts
max
)
170 °C
Preheat: Time (ts
min
to ts
max
)
65-150 seconds
Time Maintained Above: Temperature (T
L
)
217 °C
Time Maintained Above: Time (t
L
)
45-90 seconds
Peak/Classification Temperature (Tp)
235 ‑ 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp‑Down Rate
1 ‑ 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
IPC/JEDEC J‑STD‑020C
T
P
T
L
Temper
atur
e
Time
t 25˚C to Peak
Preheat
ts
t
S
t
P
25
Ramp-down
Ramp-up
Critical Zone
T
L
to T
P
Ts
max
Ts
min
