Copyright © 2008-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are registered trademarks and the Cree logo is a trademark of
Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty
information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor
endorsement, sponsorship or association.
5
XLamp
®
XR FamiLy LED SoLDERing & HanDLing
solder paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated
dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4‑mil
(102‑μm) bond line, i.e., the solder joint thickness after reflow soldering.
after soldering
After soldering, allow XLamp XR family LEDs to return to room temperature before subsequent handling. Premature handling of the
device, especially around the lens, could result in damage to the LED.
Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After
shearing selected devices from the circuit board the solder should appear completely re‑flowed (no solder grains evident). The solder
areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning pCbs after soldering
Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary,
Cree recommends the use of isopropyl alcohol (IPA).
P
CoRRECT
X
WRong
X
WRong
