Copyright © 2008-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are registered trademarks and the Cree logo is a trademark of
Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty
information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor
endorsement, sponsorship or association.
7
XLamp
®
XR FamiLy LED SoLDERing & HanDLing
moisTuRE sEnsiTiviTy
Cree recommends keeping XLamp XR‑C LEDs in the provided, resealable moisture‑barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Humidity inside the MBP can be checked immediately after opening the MBP by inspecting the humidity indicator card. The pictures
below provide a guide on how to read the humidity indicator card immediately after opening the MBP.
The humidity indicator card shows that the humidity has not
reached 10%.
The humidity indicator card shows that the humidity level has
exceeded 30%.
Once the MBP is opened, XLamp XR‑C LEDs should be handled and
stored as MSL 4 per JEDEC J‑STD‑033, meaning they have limited
exposure time before damage to the LED may occur during the
soldering operation. The table on the right specifies the maximum
exposure time in days depending on temperature and humidity
conditions. LEDs with exposure time longer than the specified
maximums must be baked according to the baking conditions listed below.
baking Conditions
It is not necessary to bake all XLamp LEDs. Only the LEDs that meet all of the following criteria must be baked:
•
LEDs that have been removed from the original MBP.
•
LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
•
LEDs that have not been soldered.
LEDs should be baked at 70 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do
not bake parts at temperatures higher than 70 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity
section above.
Temp.
maximum percent Relative Humidity
30%
40%
50%
60%
70%
80%
90%
30 ºC
9
5
4
3
1
1
1
25 ºC
12
7
5
4
2
1
1
20 ºC
17
9
7
6
2
2
1
