92
DS245F4
CS8420
18. PACKAGE DIMENSIONS
THERMAL CHARACTERISTICS AND SPECIFICATIONS
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A 0.093
0.104
2.35
2.65
A1
0.004
0.012
0.10
0.30
B
0.013
0.020
0.33
0.51
C
0.009
0.013
0.23
0.32
D
0.697
0.713
17.70
18.10
E
0.291
0.299
7.40
7.60
e
0.040
0.060
1.02
1.52
H
0.394
0.419
10.00
10.65
L
0.016
0.050
0.40
1.27
∝
0°
8°
0°
8°
Parameter
Symbol Min Typ
Max
Units
Junction to Ambient thermal impedance (28 pin SOIC)
θ
JA
-
65
-
°C/W
Allowable Junction Temperature
T
J
-
-
135
°C
28L SOIC (300 MIL BODY) PACKAGE DRAWING
D
H
E
b
A1
A
c
L
∝
SEATING
PLANE
1
e