38
EESX20 and EESX30
Release 1.5 04/2020
4.2
Estimation of heat sink’s cooling performance
To determine that the location is suitable for installing the device, perform a reference measurement:
- Install the device in the planned location.
- Switch on the device and wait until it has reached its operating temperature.
- Check whether the operating temperature at the measuring point remains below the maximum
permissible value.
- If the operating temperature of the device exceeds the maximum permissible value, switch off the device
and change the installation location, or provide additional cooling for the device.
WARNING
FIRE HAZARD
Exceeding the maximum permissible operating temperature can cause the device to catch fire.
Failure to follow these instructions can result in death, serious injury, or equipment damage.
Example: Heat dissipation with a cooling element
The following calculation delivers an estimated expected module temperature based on ambient
temperature.
Formula for estimating the device temperature with a cooling element:
R
th
x P =
∆
T
∆
T= T
case
- T
ambient
Explanation of symbols:
R
th
Thermal resistance of the heat sink [
K/W
]
P
Thermal Power [
W
]
[
K
]
Kelvin
[
W
]
Watt
∆
T
Temperature difference between case and ambient air [
K
]
T
case
Temperature of printed circuit board (Case Temperature at measuring point) [
K
]
T
ambient
Temperature of the ambient air [
K
]
