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REPAIR AND REPLACEMENT PROCEDURES
COMPONENT REMOVAL AND INSTALLATION PROCEDURES
WBPEEUI110506A0
8 - 5
14. Install the transmitter on the process.
Amplifier Assembly Removal
Perform Steps 1 through 4 in the
section.
Amplifier Assembly Installation
1. Refer to
and determine the proper replacement
cover O-rings.
2. Coat the O-rings with a film of Dow Corning No. 4 com-
pound and install.
3. Perform Steps 8 through 11 in the
ization Board Assembly Installation
section.
4. Perform the calibration procedures in
.
NOTE: This procedure assumes replacement of the amplifier
assembly only. This means that the original configuration is still
present in the characterization board memory and will be automati-
cally downloaded to the amplifier assembly.
5. Install the transmitter on the process.
Electronics Housing and Housing Cover Replacement
Use this procedure if the electronics housing sustains damage,
but the internal components and cell are unaffected.
1. Remove the transmitter from the process.
2. Remove the housing covers from the electronics housing
(Fig.
). If the housing covers
do not
require replacing, go to
Step 3. If the housing covers
do
require replacing, go to Step 6.
3. Remove the housing cover O-rings (Fig.
).
4. Refer to
and determine the proper cover O-rings.
5. Coat the cover O-rings with a film of Dow Corning No. 4
compound and install.
6. Perform Steps 3 through 8 in the
section.
7. Discard the old electronics housing and housing covers (if
required).
8. Refer to
and determine the proper cell O-ring
).
Summary of Contents for platinum standard PTSP Series
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