INTRODUCTION
I-E96-203C
3 - 1
SECTION 3 - INSTALLATION
INTRODUCTION
This section explains what must be done before placing the
multi-function processor module into operation. Read,
understand and complete the steps in the order they appear
before operating the MFP module.
NOTE: This module uses connections to the module mounting unit
backplane that served other functions in earlier Network 90 sys-
tems. To avoid potential module damage, evaluate your system for
compatibility prior to module installation.
Earlier Network 90 systems applied -30 VDC to pins three and four
of the module connector P1. This voltage is not required for
INFI 90 modules. In INFI 90 systems, pin four is used for the Con-
trolway bus.
If your system contains modules that require -30 VDC, set jumper
J5 to the 30 VDC position. Doing so allows the installation of the
MFP module in a module mounting unit that uses -30 VDC and lim-
its communication to the module bus. Refer to Table
for more
information about setting jumper J5.
SPECIAL HANDLING
Observe these steps when handling electronic circuitry:
NOTE: Always use Elsag Bailey's field static kit (part number
1948385 1 - consisting of two wrist straps, ground cord assembly,
alligator clip and static dissipative work surface) when working with
the modules. The kit grounds a technician and the static dissipative
work surface to the same ground point to prevent damage to the
modules by electrostatic discharge.
1.
Use Static Shielding Bag.
Keep the modules in the
static shielding bag until you are ready to install them in the
system. Save the bag for future use.
2.
Ground Bag Before Opening.
Before opening a bag con-
taining an assembly with semiconductors, touch it to the
equipment housing or a ground to equalize charges.
3.
Avoid Touching Circuitry.
Handle assemblies by the
edges; avoid touching the circuitry.
4.
Avoid Partial Connection of Semiconductors.
Verify
that all devices connected to the modules are properly
grounded before using them.
5.
Ground Test
Equipment.