6
1.2 Specifications
Platform
- Micro ATX Form Factor: 9.6-in x 9.6-in, 24.4 cm x 24.4 cm
- All Solid Capacitor design (100% Japan-made high-quality
Conductive Polymer Capacitors)
CPU
- Supports 3
rd
and 2
nd
Generation Intel
®
Core
TM
i7 / i5 / i3 in
LGA1155 Package
- Digi Power Design
- 4 + 2 Power Phase Design
- Supports Intel
®
Turbo Boost 2.0 Technology
- Supports Intel
®
K-Series unlocked CPU
- Supports Hyper-Threading Technology (see
CAUTION 1
)
- Supports Intel
®
Rapid Start Technology and Smart Connect
Technology with Intel
®
Ivy Bridge CPU
Chipset
- Intel
®
H77
Memory
- Dual Channel DDR3 Memory Technology (see
CAUTION 2
)
- 4 x DDR3 DIMM slots
- Supports DDR3 1600/1333/1066 non-ECC, un-buffered
memory (DDR3 1600 with Intel
®
Ivy Bridge CPU,
DDR3 1333 with Intel
®
Sandy Bridge CPU)
- Max. capacity of system memory: 32GB (see
CAUTION 3
)
- Supports Intel
®
Extreme Memory Profi le (XMP)1.3/1.2
Expansion Slot
- 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode)
(see
CAUTION 4
)
* PCIE 3.0 is only supported with Intel
®
Ivy Bridge CPU. With
Intel
®
Sandy Bridge CPU, it only supports PCIE 2.0.
- 2 x PCI Express 2.0 x16 slots (PCIE3: x1 mode;
PCIE4: x4 mode)
- 1 x PCI Express 2.0 x 1 slot
- Supports AMD Quad CrossFireX
TM
and CrossFireX
TM
Graphics
*
Intel
®
HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU
integrated.
- Supports Intel
®
HD Graphics Built-in Visuals: Intel
®
Quick
Sync Video, Intel
®
InTru
TM
3D, Intel
®
Clear Video HD
Technology, Intel
®
Insider
TM
, Intel
®
HD Graphics 2500/4000,
Intel
®
Advanced Vector Extensions (AVX)
- Pixel Shader 5.0, DirectX 11 with Intel
®
Ivy Bridge CPU.
Pixel Shader 4.1, DirectX 10.1 with Intel
®
Sandy Bridge
CPU.
- Max. shared memory 1760MB (see
CAUTION 5
)
