ashtech Z-eurocard, Operation Manual

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Equipment 15
Eq
u
ip
m
en
t
mount the board inside a metal case, use 0.200” standoffs with the adhesive thermal
pads provided with the board filling the gap between the two ICs and the metal case.
If this arrangement is not possible, an aluminum heat-sink plate is available (p/n
200541) so you can attach the board on the bottom side (again using the thermal pads)
filling the gap between the ICs and the heat-sink). You should attach the plate using
the four plated-through holes as shown.
Applications requiring 70
°
C operation should provide either a substantial heat-sink or
forced-air cooling to keep the temperature rise on the board to less than 10
°
C above
ambient.
Figure 2.5: Z-Eurocard Mounted with Heat-Sink