Chapter 9
Mechanical Data
47
24309E—March 2002
AMD Athlon™ XP Processor Model 6 Data Sheet
Preliminary Information
9
Mechanical Data
9.1
Introduction
The AMD Athlon™ XP processor model 6 connects to the
motherboard through a Pin Grid Array (PGA) socket named
Socket A. This processor utilizes the Organic Pin Grid Array
( O P G A ) p a c k a g e t y p e d e s c r i b e d i n “ O P G A Pa ck a g e
Description” on page 48. For more information, see the
AMD Athlon™ Processor-Based Motherboard Design Guide
, order#
24363.
9.2
Die Loading
The processor die on the OPGA package is exposed at the top of
the package. This feature facilitates heat transfer from the die
to an approved heat sink. It is critical that the mechanical
loading of the heat sink does not exceed the limits shown in
Table 17. Any heat sink design should avoid loads on corners
and edges of die. The OPGA package has compliant pads that
serve to bring surfaces in planar contact. Tool-assisted zero
insertion force sockets should be designed so that no load is
placed on the ceramic substrate of the package.
Table 17 shows the mechanical loading specifications for the
processor die.
Table 17. Mechanical Loading
Location
Dynamic (MAX)
Static (MAX)
Units
Note
Die Surface
100
30
lbf
1
Die Edge
10
10
lbf
2
Notes:
1. Load specified for coplanar contact to die surface.
2. Load defined for a surface at no more than a two degree angle of inclination to die surface.