Chassis and Power Supplies
Chassis Airflow
OmniSwitch 8800 Hardware Users Guide
December 2004
page 2-35
Chassis Airflow
The chassis (front) fan trays pull air from the air intake vents located at the bottom-left, bottom-front, and
bottom-right sides of the chassis. The air is directed vertically through the chassis’ front module compart-
ment and past the NI and CMM circuit boards. Airflow is then exhausted through the fan trays at the top-
left, top-front, top-right, and top-back sides of the chassis.
The fabric (back) fan tray pulls air from the air intake vents located at the middle-right side of the chassis.
The air is directed horizontally over the SFM circuit boards. Airflow is then exhausted through the fan tray
at the back of the chassis, just below the exhaust vents of the chassis fan trays.
Important.
Maintain a clearance of at least six inches at the front and back of the chassis as well at least
two inches at the left and right sides. Otherwise, airflow may become restricted. Restricted airflow can
cause your switch to overheat; overheating can lead to switch failure.
The figures below provide illustrated airflow diagrams for OS8800 switches. See the figures below for an
airflow diagram. See
for an airflow diagram describing the chassis’ power supply bays.
Chassis (Front) Airflow for OS8800 Switches
1. Air Intake.
The fan trays
pull air from the three air
intake vents located at the
bottom of the chassis.
2. Airflow.
The air from the
intake vents is directed up
through the chassis’ front
module compartment and
past the NI and CMM circuit
boards. This airflow provides
required cooling for the mod-
ules and all other chassis
components except for the
SFM boards.
3. Air Exhaust.
The air-
flow is exhausted through
all four sides of the chassis
fan trays at the top of the
chassis.
Air Intake Vents
Fan Trays
