ADLINK Technology CoreModule 430, Reference Manual

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Notice Page
DISCLAIMER
ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of
this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for
incidental or consequential damages or related expenses resulting from the use of this product, even if it has
been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from
time to time without obligation to notify any person of such revisions. If errors are found, please contact
ADLINK at the address listed below on the Notice page of this document.
Audience
This manual provides reference only for computer design engineers, including but not limited to hardware
and software designers and applications engineers. ADLNK Technology, Inc. assumes you are qualified to
design and implement prototype computer equipment.
ii Reference Manual CoreModule 430
TRADEMARKS
CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard,
MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyPanel, ReadySystem, and
RuffSystem are trademarks of ADLINK Technology, Inc. All other marks are the property of their
respective companies.
REVISION HISTORY
ADLINK Technology, Incorporated
5215 Hellyer Avenue, #110
San Jose, CA 95138-1007
Tel. 408 360-0200
Fax 408 360-0222
http://www.adlinktech.com
© Copyright 2008, 2009, 2010, 2011, 2012 ADLINK Technology, Incorporated
Revision Reason for Change Date
A, A Initial Release Oct/08
1.0 Added U9 chip to table 2-1; revised description of U7 chip in table 2-1;
revised JP7 default to pins 2-3 in table 2-3; changed document p/n from
5001840 to 50-1Z006-1000; changed rev to 1.0
Oct/09
1010
Changed pitch of J4 header in Tables 2-2 and 3-5 to 0.079
";
changed
rev of this document from 1.0 to 1010; changed pin 9 in Table 3-10
from 3.6/4.0V to 3.0V max; added BIOS Setup Screens section to ch 4;
replaced EOL, U14 video memory in Table 2-1 with new component;
changed definition of SPI Flash device
June/12