Chapter 5 Technical Specifications and Standard Compliance
Environ-
ment Pa-
rameters
Description
Cleanness
Dust concentration with a diameter of greater than 5µm
is equal to or less than ≤3×10
4
particles/m
3
, and the
dust should not be electrically conductive, magnetically
conductive or erosive.
Illumination
Prevent the equipment room from being exposed to di-
rect sunlight. Long-term exposure to the sunlight might
cause aging and deformity of the circuit boards and other
components. The average light is 150 ~ 200 LX, without
flare. Normally, the equipment room is lighted by fluo-
rescence lamps embedded in the ceiling. The equipment
room should be equipped with emergency lights.
Atmos-
pheric Pres-
sure
70 kPa~106 kPa
Air Pollution
Do not expose the equipment to corrosive gases, smog
or oil solvents. Smoking in the equipment room is for-
bidden.
Equipment Power
Consumption
FSAP 9800 Shelf power consumption (Full) is 1200 W.
Card Power
Consumption
T
ABLE
18 C
ARD
P
OWER
C
ONSUMPTION
Card
Power Consumption (W)
CSC
39
EINA
35
ATNG
45
ASNG
45
ASNV
72
APNV
72
VSNK
80
VSNVC
105
VINKC
80
STNG
45
SSNG
45
SHNG
30
ISNV
80
EPNC
11
VNKN
0
VNVN
0
Confidential and Proprietary Information of ZTE CORPORATION
67