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5.4.7
Protection of optical components
•
Do not touch the optical components with hard or abrasive objects,
•
when handling the camera, avoid touching the lenses and filter glasses,
•
fingerprints or other impurities may affect the image quality and may damage the surfaces,
•
mount / dismount lenses and additional filters only in a dust free environment.
•
do not use compressed air as this could push dust into the camera (and lenses).
5.4.8
Mechanical loads
Avoid excessive shaking, throwing, dropping or any kind of mishandling of the device.
5.4.9
Camera / lens cleaning
•
Use only optical quality tissue / cloth (dry cotton) a standard camera lens cleaning kit, if you must clean a lens or filter. Do not apply
excessive force.
•
Use only optics cleaner (e.g. 60 % ethyl alcohol, 40 % ether). Never use aggressive cleaners like gasoline or spirits. Such cleaners
may destroy the surface.
•
Do not use compressed air.
5.4.10
Protect against static discharge (
)
Image sensors and the
are easily damaged by static discharge (
•
Please use anti-static gloves, clothes and materials. Also use conductive shoes.
•
Wear an
protection wrist strap.
•
Install a conductive mat on the floor and/or working table to prevent the generation of static electricity.
5.4.11
Safety instruction for board level cameras
Abuse or misapplication of the board level camera may result in limited warranty or cancelation of warranty. Due to the exposed electronics,
special rules apply:
•
Only qualified personnel are allowed to handle, install and operate the board level cameras.
•
Board level cameras are delivered without housing. Handle the
and the sensor with care. Do not bend the boards. Do not touch
the components or contacts on a board. Hold the board by its edges only.
•
Protect the board level camera against static discharge (see
Protect against static discharge (ESD)
discharge (
)).
•
Do not hold any components of your board level cameras against your clothing, even if you are wearing a wrist strap.
•
Do not remove the board level camera from its anti-static packaging unless your body is grounded.
•
To protect the boards from radiation of other modules or devices a housing or shielding may be required.
•
Be sure that the board level camera has no contact to any electrical source before mounting or making connections to the board
level camera.
•
Do not connect or disconnect any cables or use the board level camera during an electrical storm.
•
Avoid any mechanical forces to the board level cameras, especially torsional, tensile and compressive forces. Any of these forces
may result in damage of the board level cameras.
•
Always use clean boards.
•
To protect the boards from dirt like dust or liquids always use the board level cameras in clean room environment or use a protective
housing.
XIMEA Technical Manual, Version: v240108
91
Содержание xiX-XL
Страница 18: ...Figure 8 Optical path cross section of MX1510 FF XIMEA Technical Manual Version v240108 11...
Страница 28: ...Figure 13 MX610xR SY X4G3 FF with detached sensor sub assembly XIMEA Technical Manual Version v240108 21...
Страница 30: ...Figure 15 MX610xR SY X4G3 FF with detached sensor sub assembly XIMEA Technical Manual Version v240108 23...
Страница 32: ...Figure 17 MX1018xR SY X4G3 FF with detached sensor sub assembly XIMEA Technical Manual Version v240108 25...
Страница 34: ...Figure 19 MX1018xR SY X4G3 FF with detached sensor sub assembly XIMEA Technical Manual Version v240108 27...
Страница 36: ...Figure 21 MX1510xR SY X4G3 FF with detached sensor sub assembly XIMEA Technical Manual Version v240108 29...
Страница 38: ...Figure 23 MX1510xR SY X4G3 FF with detached sensor sub assembly XIMEA Technical Manual Version v240108 31...
Страница 46: ...Digital input Wiring Figure 30 digital input interface wiring XIMEA Technical Manual Version v240108 39...
Страница 111: ...XIMEA GmbH Am Mittelhafen 16 48155 M nster Germany www ximea com Copyright XIMEA GmbH All rights reserved...