ZC706 Evaluation Board User Guide
22
UG954 (v1.5) September 10, 2015
Feature Descriptions
The ZC706 DDR3 SODIMM interface adheres to the constraints guidelines documented in
the “Dynamic Memory” section of the
Zynq-7000 All Programmable SoC PCB Design and Pin
Planning Guide
(
). The ZC706 DDR3 SODIMM interface is a 40
Ω
impedance
implementation. For more details, see the MT8JTF12864HZ-1G6G1 data sheet
.
DDR3 Component Memory (PS)
[
, callout 3]
The 1 GB, 32-bit wide DDR3 component memory system is comprised of four 256 Mb x 8
SDRAMs (Micron MT41J256M8HX-15E) at U2-U5. This memory system is connected to the
XC7Z045 AP SoC Processing System (PS) memory interface bank 502. The DDR3 0.75V VTT
termination voltage is sourced from linear regulator U27. The connections between the
DDR3 component memory and XC7Z045 AP SoC bank 502 are listed in
E7
PL_DDR3_CAS_B
SSTL15
115
CAS_B
H11
PL_DDR3_RAS_B
SSTL15
110
RAS_B
D10
PL_DDR3_CKE0
SSTL15
73
CKE0
C7
PL_DDR3_CKE1
SSTL15
74
CKE1
F10
PL_DDR3_CLK0_N
DIFF_SSTL15
103
CK0_N
G10
PL_DDR3_CLK0_P
DIFF_SSTL15
101
CK0_P
D8
PL_DDR3_CLK1_N
DIFF_SSTL15
104
CK1_N
D9
PL_DDR3_CLK1_P
DIFF_SSTL15
102
CK1_P
Table 1-5:
DDR3 Component Memory Connections to the XC7Z045 AP SoC
XC7Z045 (U1) Pin
Net Name
Component Memory
Pin Number
Pin Name
Ref. Des.
E26
PS_DDR3_DQ0
B3
DQ0
U2
A25
PS_DDR3_DQ1
C7
DQ1
U2
E27
PS_DDR3_DQ2
C2
DQ2
U2
E25
PS_DDR3_DQ3
C8
DQ3
U2
D26
PS_DDR3_DQ4
E3
DQ4
U2
B25
PS_DDR3_DQ5
E8
DQ5
U2
D25
PS_DDR3_DQ6
D2
DQ6
U2
B27
PS_DDR3_DQ7
E7
DQ7
U2
A27
PS_DDR3_DQ8
B3
DQ8
U3
A28
PS_DDR3_DQ9
C7
DQ9
U3
A29
PS_DDR3_DQ10
C2
DQ10
U3
Table 1-4:
DDR3 SODIMM Socket J1 Connections to the XC7Z045 AP SoC
(Cont’d)
XC7Z045 (U1)
Pin
Net Name
I/O Standard
DDR3 SODIMM Memory J1
Pin Number
Pin Name