Xandex 340-7110, Инструкция по установке и эксплуатации

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Ink Curing Ink
820-0332
5-2
Ink Curing
The procedure for curing will depend on the type of ink used and other factors such as dot
size and spacing (see “General Notes on Ink Curing”, below). Xandex guidelines are
developed under laboratory conditions using single wafers and are intended as a baseline
to develop a curing process that meets your specific needs.
6990, 6993, and 6997 should be cured/baked within 2 hours of inking due to the
evaporation of solvents in the ink over time. If a wafer (or boat of wafers) is left uncured
for an extended period of time, the dots may crack and/or flake after the baking process.
6990, 6993, and 6997 inks, when air-dried, will not smear when touched. They are not
permanent, however, and will not withstand most post-probe handling or processes.
Conversely, 7824 and 7824T inks air cure within 2.5 hours ( ≤ 20 mil, up to 10 hours for
>20 mil dots). 7824 and 7824T may also be heat cured at up to 150°C for 10 minutes.
8103 and 8104 Glycol Free inks hard cure under ambient conditions in the least time of
any of the inks offered by Xandex. Ink dots of ≤ 25 mil typically air dry to a hard cure in
45 minutes. Dot sizes >25 mil may require significantly longer to cure. An ambient cure
time of up to 6 hours may be needed for larger dot sizes. 8103 and 8104 may also be heat
cured at up to 150
°
C for 10 minutes if a faster cure is desired.
General Notes on Ink Curing
Several factors have greater influence on the time required to get a full cure in the shortest
amount of time, either when heat curing or curing at room temperature:

Dot Size : Larger dot sizes will require longer cure times.

Dot Spacing : Large numbers of closely spaced ink dots will require a longer cure
time than small numbers of widely spaced dots.

Air Flow: Continuous air flow across the wafer surface will reduce the amount of
time required for ink curing. This is especially important when air curing at ambient
temperatures.

Wafer/Die Surface : Both the surface chemistry and degree of patterning on the die
affect how the ink spreads on the wafer. If the ink does not spread as much, the dots
will be thicker. And if the dots are thicker, they will require a longer cure time.

Temperature : Higher temperatures will lead to faster ink cure times.

Wafer Boat / Cassette : Wafers stacked in a boat / cassette will require increased
cure time compared to single wafers.