Western Digital scorpio black MX375M, Техническое справочное руководство

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WD Scorpio MX375M Table of Contents
2679-771293-A01 RELEASED 11/17/10 (WD CONFIDENTIAL) i
T
ABLE OF
C
ONTENTS
1. D
ESCRIPTION AND
F
EATURES
................................................................................................. 1
1.1 General Description ....................................................................................................................................................................... 1
1.2 Product Features ............................................................................................................................................................................ 1
2. S
PECIFICATIONS
....................................................................................................................... 3
2.1 Performance Specifications ......................................................................................................................................................... 3
2.2 Physical Specifications.................................................................................................................................................................. 4
2.2.1
Physical Dimensions ...................................................................................................................................................... 5
2.3 Mechanical Specifications............................................................................................................................................................ 6
2.4 Electrical Specifications................................................................................................................................................................ 7
2.4.1
Current Requirements and Power Dissipation ........................................................................................................ 7
2.4.2 Input Voltage Requirements ......................................................................................................................................... 8
2.4.3 Ripple................................................................................................................................................................................. 8
2.5 Environmental Specifications....................................................................................................................................................... 8
2.5.1
Shock and Vibration ....................................................................................................................................................... 8
2.5.2 Temperature and Humidity ........................................................................................................................................... 9
2.5.3 Thermocouple Location................................................................................................................................................. 9
2.5.4 Cooling ............................................................................................................................................................................10
2.5.5 Atmospheric Pressure .................................................................................................................................................10
2.5.6 Acoustics ........................................................................................................................................................................10
2.5.7 RoHS (Restriction of Hazardous Substances) ......................................................................................................10
2.6 Reliability Specifications .............................................................................................................................................................10
2.7 Device Plug Connector Pin Definitions ...................................................................................................................................11
2.8 Agency Approvals.........................................................................................................................................................................12
2.9 Full Model Number Specification..............................................................................................................................................12
3. P
RODUCT
F
EATURES
.............................................................................................................. 13
3.1 SATA 3 Gb/s and SATA 1.5 Gb/s ..........................................................................................................................................14
3.2 Perpendicular Magnetic Recording (PMR).............................................................................................................................14
3.3 Reduced Power Spinup (RPS) .................................................................................................................................................15
3.4 System-on-Chip (SOC)..............................................................................................................................................................15
3.5 S.M.A.R.T. Command Transport (SCT)...................................................................................................................................16
3.5.1
Write Same ....................................................................................................................................................................16
3.5.2 Read/Write Long ..........................................................................................................................................................16
3.5.3 Temperature Reporting................................................................................................................................................16
3.6 Reliability Features Set................................................................................................................................................................17
3.6.1
Data Lifeguard™ ............................................................................................................................................................17
3.6.2 Thermal Management ..................................................................................................................................................17
3.6.3 Internal Environmental Protection System ..............................................................................................................18
3.6.4 Recoverable Errors .......................................................................................................................................................18
3.6.5 Unrecoverable Errors ...................................................................................................................................................18
3.6.6 Self Test ..........................................................................................................................................................................18
3.6.7 ATA Error Logging........................................................................................................................................................18
3.6.8 Defect Management.....................................................................................................................................................18
3.6.9 Automatic Defect Retirement.....................................................................................................................................19
3.6.10 Error Recovery Process...............................................................................................................................................19
3.7 Hot Plug Support..........................................................................................................................................................................20
3.7.1
Hot Plug Technical Issues ..........................................................................................................................................20
3.8 Active LED Status ........................................................................................................................................................................22
3.9 Fluid Dynamic Bearings (FDB) ..................................................................................................................................................23
3.10 Staggered Spinup and Activity Indication (SATA Power Pin 11) .....................................................................................23
3.10.1 Staggered Spinup ........................................................................................................................................................23
3.10.2 Activity Indication ..........................................................................................................................................................23
3.11 CacheFlow™ ..................................................................................................................................................................................23
3.11.1 Write Cache...................................................................................................................................................................24
3.11.2 Read Cache ...................................................................................................................................................................24
3.11.3 48-bit Logical Block Addressing (LBA) ..................................................................................................................24