WAGO-I/O-SYSTEM 750
Table of Contents
3
750-657 IO-Link Master
Manual
Version 1.0.2, valid from FW/HW-Version 02/01
Pos: 5 /Dokumentation allgemein/Verzeichnisse/Inhaltsverzeichnis - ohne Gliederung - und Verzeichnis @ 3\mod_1219151230875_21.doc @ 21063 @ @ 1
Table of Contents
1
Notes about this Documentation................................................................. 7
1.1
Validity of this Documentation................................................................. 7
1.2
Copyright................................................................................................... 7
1.3
Symbols..................................................................................................... 8
1.4
Number Notation..................................................................................... 10
1.5
Font Conventions .................................................................................... 10
2
Important Notes ......................................................................................... 11
2.1
Legal Bases ............................................................................................. 11
2.1.1
Subject to Changes ............................................................................. 11
2.1.2
Personnel Qualifications..................................................................... 11
2.1.3
Use of the 750 Series in Compliance with Underlying Provisions .... 11
2.1.4
Technical Condition of Specified Devices ......................................... 12
2.2
Safety Advice (Precautions).................................................................... 13
3
The IO-Link Technology........................................................................... 15
4
Device Description ..................................................................................... 16
4.1
View ........................................................................................................ 19
4.2
Connectors............................................................................................... 21
4.2.1
Data Contacts/Internal Bus................................................................. 21
4.2.2
Power Jumper Contacts/Field Supply ................................................ 22
4.2.3
CAGE CLAMP
®
Connections ........................................................... 23
4.3
Display Elements .................................................................................... 24
4.4
Schematic Diagram ................................................................................. 25
4.5
Technical Data ........................................................................................ 26
4.5.1
Device Data ........................................................................................ 26
4.5.2
Supply................................................................................................. 26
4.5.3
Communication .................................................................................. 26
4.5.4
IO-Link Ports...................................................................................... 27
4.6
Approvals ................................................................................................ 29
4.7
Standards and Guidelines........................................................................ 30
5
Function Description ................................................................................. 31
5.1
Parameter Model of the IO-Link Master................................................. 32
6
Process Image ............................................................................................. 33
6.1
Control/status byte .................................................................................. 34
6.2
Mailbox ................................................................................................... 35
6.3
SIO Byte.................................................................................................. 35
6.4
Cyclic Process Data................................................................................. 36
6.4.1
Unfragmented Process Data ............................................................... 38
6.4.2
Fragmented Process Data ................................................................... 38
7
Mounting..................................................................................................... 39
7.1
Assembly Sequence ................................................................................ 39
7.2
Inserting and Removing Devices ............................................................ 40
7.2.1
Inserting I/O Module .......................................................................... 40
7.2.2
Removing the I/O Module.................................................................. 41