Vincotech 2xflowSCREW4w, Инструкция по эксплуатации

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flowSCREW 4w packages
Copyright Vincotech
Handling Instruction
03 rem. sect. 5.2; mod. at sect. 5.1 29.09.2014
Gyimóthy Zs.
Gyetvai T.
FSWB-M-*-HI
Page
2 /
18
02 remove section 6.2 14.05.2014
Gyimóthy Zs.
Gyetvai T.
01 20.02.2014
Gyimóthy Zs.
Gyetvai T.
Ver. Alteration Date Des. / Mod. Appr.
Table of contents:
1 General remarks .........................................................................................................................................................4
2 Specification for the driver PCB ..................................................................................................................................5
2.1 PCB assembly with press-fit technology ........................................................................................................................6
2.2 PCB assembly with soldered Press-fit pin modules ........................................................................................................6
3 Base plate surface specification ..................................................................................................................................6
4 Heatsink specification ................................................................................................................................................8
5 Thermal grease specification ......................................................................................................................................8
5.1 Option 1: Uniform layer of thermal paste .....................................................................................................................8
5.2 Option 2: Module with pre-applied thermal phase change material ............................................................................8
6 Screw and torque specifications for fastening the module to the heatsink.................................................................9
7 Screw specification for fastening main terminals to bus bars ................................................................................... 11
8 flowSCREW 4w modules in parallel mode ................................................................................................................ 11
8.1 Mounting the M4 hex nut-holder for side connection .................................................................................................11
8.2 Interconn PCB ..............................................................................................................................................................12
9 Press-fitting .............................................................................................................................................................. 13
9.1 Press-in setup ..............................................................................................................................................................13
9.1.1 Press-in tool .......................................................................................................................................................14
9.1.2 Support plate .....................................................................................................................................................14
9.2 Press-fitting parameters ..............................................................................................................................................14
9.2.1 Basic requirements for press-fitting ..................................................................................................................15
9.3 Process control parameters .........................................................................................................................................15
9.4 Disassembling a driver PCB .........................................................................................................................................16
10 Recommendation for soldering ................................................................................................................................ 17
10.1 Wave soldering modules with solder pins ..............................................................................................................17
10.2 Hand soldering parameters ....................................................................................................................................18
11 Accessories and application support ........................................................................................................................ 18
12 ESD protection .......................................................................................................................................................... 18
13 Disclaimer ................................................................................................................................................................ 18