flowSCREW 4w
packages
Copyright Vincotech
Handling Instruction
03
rem. sect. 5.2; mod. at sect. 5.1 29.09.2014
Gyimóthy Zs.
Gyetvai T.
FSWB-M-*-HI
Page
5 /
18
02
remove section 6.2
14.05.2014
Gyimóthy Zs.
Gyetvai T.
01
20.02.2014
Gyimóthy Zs.
Gyetvai T.
Ver.
Alteration
Date
Des. / Mod.
Appr.
The distance between the top of the heatsink and the center plane of the driver PCB is
20.
68±0.2 mm centered on the pinhead as shown in
Figure 2
.
Figure 2: Height of the pinhead's center line from the bottom of the base plate
During PCB assembly, do not pull or push auxiliary press-fit or soldered pins
more than ±0.2
mm, nor exert a force greater than 35 N except when press-fitting pins. Press-fit pins are
designed to prevent pin deformations greater than 0.1 mm when they are pressed in.
After mounting, pin tension may
not exceed ±5 N at a maximum substrate temperature of
100 C.
2 Specification for the driver PCB
Printed board material must comply with IEC 61249-2-7.
There is no limit as to the maximum number of conductive layers.
The driver PCB attaches to the module with four type BN82428 (screws D=2.5 mm and
L=6mm). The recommended mounting torque is 0.4Nm.
Figure 3
shows the recommended
holes and cutouts on the driver PCB.
Figure 3: Recommended hole and
cutout sizes on the driver PCB
