VERITAS Mk.II, Руководство пользователя

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16
Veritas
®
Mk.II Power Sharpening System
f) When the face of the blade has been fully lapped
with the 40µ abrasive, switch to 9µ. Continue
lapping until the scratch pattern created by the
previous step has been removed. When lapping
is complete, the face of the blade adjacent to the
cutting edge should be flat and polished enough
to allow you to clearly see your own reflection
1
.
It helps to rotate the tool’s position about a vertical
axis relative to the turntable between steps of the
lapping process. For example, when lapping with
100µ, hold the blade so it points toward the platter
retention thumbscrew in the center of the turntable.
For the next step, 40µ, hold the blade so it is at least
45° from the previous position (see
Figure 16 ).
Using this method, the scratches formed by each
step will always be at an angle to those created
during the previous step, making it very easy to tell
when they have all been removed.
Step 2: Create the Primary Bevel
a) Select a bevel angle and set the tool guide by
raising or lowering it so the desired angle is the
lowest visible number on the tool guide scale;
it should click into position. The enclosed brass
bevel gauge will help you determine the initial
bevel angle of your tool.
b) Clamp the tool into the tool holder as shown in
Figure 8 . Make sure the side of the tool is firmly
up against one of the shoulders of the tool holder.
If the blade is wide and short and is awkward to
set up as shown, see
Chapter 3, Short Projection .
Tighten the tool holder nuts progressively so that
the tool holder is not bent.
c) The projection of the blade may also be registered
without the use of the projection jig. With the
tool guide assembly set to 40°*, the tool holder
engaged on the guide rod and the tool loosely
clamped in place, extend the blade edge until it
touches the platter retention thumbscrew as shown
in
Figure 18 .
*This angle is only for setting purposes; all bevel
angles shown on the tool guide scale on the tool
post are achievable once blade projection is set
by either method.
d) If the existing bevel of the tool is to be changed
(most chisels and planes are sold with a 25° primary
bevel), use the 80x abrasive to start. If the bevel angle
is not to be changed, start with the 100µ abrasive.
e) With the power on, engage the tool holder on the
guide rod and lower the blade down into contact
with the turntable as shown in
Figure 19 . This
should be done on the right side of the turntable
to make a leading cut. If the blade is abraded on
the left side of the turntable, the resultant trailing
cut will quickly create a large wire edge as well as
increase the danger of overheating the edge.
f) Position the tool as shown in Figure 19 while
moving the blade back and forth and applying a
consistent pressure downward on the turntable. As
with lapping, the blade can become too hot to hold,
risking loss of blade hardness. If it does, remove it
from the turntable and allow it to cool. A temperature
that is uncomfortable to touch is much lower than
the temperature at which the hardness of the blade
can be affected (see
Excessive Heat Build-Up in
Troubleshooting for more information). As a general
rule, when traversing the blade side to side during
grinding, stay at least
1
/
4
" inside of the edge of the
platter. This prevents the bevel from becoming
irregular should there be any damage on the edge of
the platter or if the abrasive is peeling.
Figure 18: Alternative blade projection method.
Figure 19: Creating the primary bevel.
Contact
Platter Retention
Thumbscrew
Set to 40°
1
Additional abrasive grades are available (60µ and 20µ) to reduce the jump in particle size and make lapping more effecient (see Appendix B ).