INSTALLATION GUIDE
PAGE
25
BONDING CONNECTIONS & GROUNDING PATHS
TEMPORARY BONDING CONNECTION DURING ARRAY MAINTENANCE
When removing modules for replacement or system maintenance, any module left in place that is secured
with a bonding Midclamp will be properly grounded. If a module adjacent to the end module of a row is
removed or if any other maintenance condition leaves a module without a bonding mid clamp, a temporary
bonding connection must be installed as shown
•
Attach Ilsco SGB4 to wall of rail
•
Attach Ilsco SGB4 to module frame
•
Install solid copper wire jumper to Ilsco lugs
MODULE REMOVED
BONDING MID
CLAMPS MAINTAIN
GROUND PATH
TEMPORARY
BONDING
CONNECTION
ELECTRICAL CONSIDERATIONS
NXT UMOUNT is intended to be used with PV
modules that have a system voltage less than
or equal to that allowable by NEC. For standard
system grounding a minimum 10AWG, 105°C copper
grounding conductor should be used to ground
a system, according to the National Electric Code
(NEC). It is the installer’s responsibility to check local
codes, which may vary. See below for interconnection
information.
INTERCONNECTION INFORMATION
There is no size limit on how many NXT UMOUNT
& PV modules can be mechanically interconnected
for any given configuration, provided that the
installation meets the requirements of applicable
building and fire codes.
GROUNDING NOTES
The installation must be conducted by a licensed and
bonded electrician or solar contractor in accordance
with the National Electric Code (NEC) and the
authority having jurisdiction. Please refer to these
resources in your location for required grounding lug
quantities specific to your project.
The grounding / bonding components may overhang
parts of the array so care must be made when
walking around the array to avoid damage.
Conductor fastener torque values depend on
conductor size. See product data sheets for correct
torque values.
PERIODIC INSPECTION
Conduct periodic inspections for loose components,
loose fasteners or any corrosion, immediately replace
any affected components.
Ilsc
o SGB-4
SOLID
COPPER
WIRE
Ilsc
o SGB-4
REQUIRED ONLY FOR TEMPORARY
BONDING DURNING ARRAY MAINTENANCE
CAUTION
Module removal may disrupt the bonding path and could introduce the risk of electric shock.
Follow above mentioned instructions to maintain the bonding path.
