VERA-P1 series - Data Sheet
UBX-17004377 - R04
Confidential
Product handling & soldering
Page 23 of 28
7.2.2
Mounting process and soldering recommendations
The VERA-P1 series module is a surface mount module supplied on an 8-layer FR4-type PCB with gold plated
connection pins and produced in a lead-free process with a lead-free soldering paste. The wrap page of the PCB
is max. 0,75% according to IPC-A-610E. The thickness of solder resist on the host PCB top side and the
JODY-W1 bottom side must be considered for the soldering process.
This module is compatible with industrial reflow profile for RoHS/Pb-free solders, Sn96.5/Ag3.0/Cu0.5 solder is a
right choice. Use of "No Clean" soldering paste is strongly recommended, cleaning the populated modules is
strongly discouraged - residuals under the module cannot be easily removed with any cleaning process. Cleaning
with water can lead to capillary effects where water is absorbed into the gap between the host board and
module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pins.
Only a single reflow soldering process is permitted for host boards with the VERA-P1 series modules.
The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency
of the oven and particular type of solder paste used. Since the profile used is process and layout dependent, the
optimum profile should be studied case by case. Recommendations below should be taken as a starting point
guide. In case of basic information necessity, refer to J-STD-020C standard.
Profile feature
Sn-Pb eutectic
(Sn63/Pb37)
RoHS/Pb-free
(Sn96.5/Ag3.0/Cu0.5)
Ramp up rate (T
SMAX
to T
P
)
3 °C/sec max
3 °C/sec max
Minimum soak temperature (T
SMIN
)
100 °C
150 °C
Maximum soak temperature (T
SMAX
)
150 °C
200 °C
Soak time (ts)
60 - 120 sec
60 - 180 sec
Liquidus temperature (T
L
)
183 °C
217 °C
Time above T
L
(t
L
)
60 - 150 sec
60 - 150 sec
Peak temperature (T
P
)
215 – 225 °C
235 – 245 °C
Time 0 / -5°C of actual TP (tp)
10 - 30 sec
20 - 40 sec
Ramp down rate
6 °C/sec max
6 °C/sec max
Time from 25°C to T
P
6 min max
8 min max
Table 16: Recommended reflow profile
The lowest value of T
P
and slower ramp down rate (2 – 3 °C/sec) is preferred.
Figure 6: Reflow profile
