VERA-P1 series - Data Sheet
UBX-17004377 - R04
Confidential
Mechanical specifications
Page 19 of 28
Symbol
Description
Millimeters
Min.
Nom.
Max.
A
Module Thickness
3.3
3.5
3.7
A1
Vertical distance from the solder mask to the pad surface
0.010
0.020
0.035
b
Width of the peripheral pads
0.70
0.75
0.80
D
Module horizontal dimension
24.8 BSC
D2
Horizontal dimension of the exposed thermal pads pattern
17.7
17.8
17.9
D3
Horizontal dimension of the individual exposed thermal pad
3.9
4.0
4.1
E
Module vertical dimension
29.6 BSC
E2
Vertical dimension of the exposed thermal pads pattern
22.3
22.4
22.5
E3
Vertical dimension of the individual exposed thermal pad
3.9
4.0
4.1
e
Pitch of the peripheral pads
1.2 BSC
E1
Pitch of the individual exposed thermal pads
4.6 BSC
aaa
Bilateral profile tolerance of the module body
0.2
ddd
Co-planarity of the module bottom surface (unilateral tolerance)
0.1
eee
Tolerance of the peripheral pads pattern position
0.2
fff
Tolerance of the peripheral pads position with respect to each other
0.04
ggg
Tolerance of the exposed thermal pads pattern position
0.08
Table 13: VERA-P1 series dimensional references
The “aaa” tole/- 0.2 mm may be exceeded in the corners of the PCB due to the cutting process.
In worst case, the outer dimension “D” could reach 25.1 mm.
