LEA-6 / NEO-6 - Hardware Integration Manual
GPS.G6-HW-09007-A
Preliminary
Product handling
Page 39 of 62
Heating/ Reflow phase
The temperature rises above the liquidus temperature of 217°C. Avoid a sudden rise in temperature as the slump
of the paste could become worse.
•
Limit time above 217°C liquidus temperature: 40 - 60s
•
Peak reflow temperature: 245°C
Cooling phase
A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and
possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a
good shape and low contact angle.
•
Temperature fall rate: max 4°C / s
To avoid falling off, the u-blox 6 GPS module should be placed on the topside of the motherboard during
soldering.
The final soldering temperature chosen at the factory depends on additional external factors like choice of
soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering
temperature in the recommended soldering profile may permanently damage the module.
Figure 32: Recommended soldering profile
When soldering u-blox 6 modules in a leaded
o
PB- Technology Soaktime:
40-80sec
process, check the following temperatures:
o
Time above Liquidus:
40-90 sec
o
Peak temperature:
225-235 °C
u-blox 6 modules
must not
3.2.3
Optical inspection
be soldered with a damp heat process.
After soldering the u-blox 6 module, consider an optical inspection step to check whether:
•
The module is properly aligned and centered over the pads
•
All pads are properly soldered
•
No excess solder has created contacts to neighboring pads, or possibly to pad stacks and vias nearby.
- datasheet search engine
