LEA-6 / NEO-6 - Hardware Integration Manual
GPS.G6-HW-09007-A
Preliminary
Design-in
Page 26 of 62
17.0 mm [669 mil]
22.
4 m
m
[881
.9
m
il]
1.0 mm
[39 mil]
0.
8 mm
[3
1.
5 m
il]
2.
45 m
m
[9
6.
5 m
il]
1.
1 mm
[43 m
il]
3.
0 mm
[11
8 m
il]
2.
15 m
m
[84
.5 m
il]
0.8 mm
[31.5 mil]
Figure 14: LEA-6 footprint
Stencil: 200
µ
m
15.7 mm [618 mil]
17.0 mm [669 mil]
20.8 mm [819 mil]
0
.8
m
m
[31.
5
m
il]
0
.6
m
m
[23.
5
m
il]
Figure 15: LEA-6 paste mask
12.2 mm [480.3 mil]
16.
0 m
m
[
63
0 m
il]
1.0 mm
[39.3 mil]
0
.8
mm
[3
1.
5
m
il]
0.8 mm
[31.5 mil]
3
.0
mm
[1
18
.1
m
il]
1
.0
mm
[3
9.
3 m
il]
1
.1
mm
[4
3.
3
m
il]
Figure 16: NEO-6 footprint
Stencil: 170
µ
m
10.4 mm [409.5 mil]
14.6 mm [575 mil]
12.2 mm [480 mil]
0
.8
m
m
[31.
5 m
il]
0
.6
m
m
[23.
5 m
il]
Figure 17: NEO-6 paste mask
The paste mask outline needs to be considered when defining the minimal distance to the next
component.
The exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the
specific production processes (e.g. soldering etc.) of the customer.
2.4.2
Placement
A very important factor in achieving maximum performance is the placement of the receiver on the PCB. The
connection to the antenna must be as short as possible to avoid jamming into the very sensitive RF section.
Make sure that RF critical circuits are clearly separated from any other digital circuits on the system board. To
achieve this, position the receiver digital part towards your digital section of the system PCB. Care must also be
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