u-blox EVA-8M Series, Руководство по интеграции оборудования

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EVA-8M and EVA-M8 series - Hardware Integration Manual
UBX-16010593 - R06 Page 4 of 47
Early Production Information
2.12 Migration considerations ........................................................................................................................ 22
2.12.1 Hardware migration from EVA-7M to EVA-8M / EVA-M8M / EVA-M8Q .............................. 22
2.12.2 C88-M8M - Evaluating EVA-M8M on existing NEO-xM sockets ............................................ 24
2.13 EOS/ESD/EMI precautions ...................................................................................................................... 25
2.13.1 Electrostatic Discharge (ESD) ....................................................................................................... 26
2.13.2 ESD protection measures ............................................................................................................... 26
2.13.3 Electrical Overstress (EOS) ............................................................................................................ 26
2.13.4 EOS protection measures ............................................................................................................... 26
2.13.5 Electromagnetic interference (EMI) ............................................................................................. 27
2.13.6 Applications with cellular modules ............................................................................................... 27
3 Product handling & soldering .......................................................................................................... 30
3.1 Packaging, shipping, storage and moisture preconditioning .......................................................... 30
3.2 ESD handling precautions ....................................................................................................................... 30
3.3 Soldering ..................................................................................................................................................... 30
3.3.1 Soldering paste ................................................................................................................................. 30
3.3.2 Reflow soldering ................................................................................................................................ 31
3.3.3 Optical inspection ............................................................................................................................. 31
3.3.4 Repeated reflow soldering .............................................................................................................. 31
3.3.5 Wave soldering .................................................................................................................................. 31
3.3.6 Rework ................................................................................................................................................ 31
3.3.7 Use of ultrasonic processes ........................................................................................................... 31
4 Product testing ................................................................................................................................... 32
4.1 Test parameters for OEM manufacturer ............................................................................................. 32
4.2 System sensitivity test ............................................................................................................................ 32
4.2.1 Guidelines for sensitivity tests ...................................................................................................... 32
4.2.2 ‘Go/No go’ tests for integrated devices ........................................................................................ 32
Appendix ....................................................................................................................................................... 33
A Reference schematics ....................................................................................................................... 33
A.1 Cost optimized circuit .............................................................................................................................. 33
A.2 Best performance circuit with passive antenna ................................................................................. 34
A.3 Improved jamming immunity with passive antenna ......................................................................... 35
A.4 Circuit using active antenna ................................................................................................................... 36
A.5 USB self-powered circuit with passive antenna ................................................................................. 37
A.6 USB bus-powered circuit with passive antenna ................................................................................. 38
A.7 Circuit using 2-pin antenna supervisor ................................................................................................ 39
A.8 Circuit using 3-pin antenna supervisor ................................................................................................ 40
B Component selection ........................................................................................................................ 41
B.1 External RTC (Y1) ...................................................................................................................................... 41
B.2 RF band-pass filter (F1) ........................................................................................................................... 41
B.3 External LNA protection filter (F2) ........................................................................................................ 42
B.4 USB line protection (D2) .......................................................................................................................... 42
B.5 USB LDO (U1) ............................................................................................................................................. 42