EVA-8M and EVA-M8 series - Hardware Integration Manual
UBX-16010593 - R06
Product handling & soldering
Page 31 of 47
Early Production Information
The paste-mask geometry for applying soldering paste should meet the recommendations given in
section 2.11.2.
3.3.2
Reflow soldering
Condition
Abbreviation
Recommendation
Preheat/ Soak Temperature min.
Preheat/ Soak Temperature max.
Preheat/ Soak Time from T
smin
to T
smax
T
smin
T
smax
T
s
(T
smin
to T
smax
)
150°C
180°C
< 90 seconds
Liquidus Temperature
Time maintained above T
L
T
L
t
L
217°C
40 to 60 seconds
Peak Package Body Temperature
T
P
250°C
Ramp up rate (T
L
to T
P
)
3°C/ second max.
Time 0°C…-5°C of T
P
30 seconds
Ramp down rate (T
P
to T
L
)
4°C/ second max.
Table 9: Recommended conditions for reflow process
The peak temperature must not exceed 250°C. The time above 245°C must not exceed 30 seconds.
☞
EVA-8M / EVA-M8 series GNSS modules
must not
be soldered with a damp heat process.
3.3.3
Optical inspection
After soldering the modules, consider an optical inspection step to check whether:
•
The module is properly aligned and centered over the pads
3.3.4
Repeated reflow soldering
Only single reflow soldering process is recommended for boards populated with EVA-8M / EVA-M8
series GNSS modules.
3.3.5
Wave soldering
Base boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices require wave soldering to solder the THT components. Only a single wave
soldering process is encouraged for boards populated with EVA-8M / EVA-M8 series GNSS modules.
3.3.6
Rework
Not recommended.
3.3.7
Use of ultrasonic processes
Some components on the EVA-8M / EVA-M8 series GNSS modules are sensitive to Ultrasonic Waves.
Use of any Ultrasonic Processes (cleaning, welding etc.) may cause damage to the GNSS Receiver.
☞
u-blox offers no warranty against damages to the EVA-8M / EVA-M8 series GNSS modules caused
by any Ultrasonic Processes.
