User's Manual l TQMa8XxS UM 0101 l © 2022, TQ-Systems GmbH
Page 40
6.4
Climate and operational conditions
The operating temperature range for the TQMa8XxS strongly depends on the installation situation (heat dissipation by heat
conduction and convection); hence, no fixed value can be given for the TQMa8XxS.
The TQMa8XxS is available in three different variants with different temperature ranges. In general, a reliable operation is given
when following conditions are met:
Table 24:
Climate and operational conditions industrial temperature range
Parameter
Range
Remark
Ambient temperature
–25 °C to +60 °C
–
T
J
i.MX 8X
-40 °C to 105 °C
–
T
J
PMIC
-40 °C to 150 °C
–
Case temperature SDRAM
-40 °C to 85 °C
–
Case temperature other
ICs
Variant C
0 °C to 85 °C
Consumer
Variant E
-25 °C to 85 °C
Extended (Standard)
Variant I
-40°C to 85 °C
Industrial
Relative humidity (operating / storage)
10 % to 90 %
Not condensing
Attention: Destruction or malfunction, TQMa8XxS heat dissipation
The TQMa8XxS belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA
package, thermal pad, heatsink) as well as the maximum pressure on the i.MX 8X must be taken into
consideration when connecting the heat sink.
The i.MX 8X is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMa8XxS and thus malfunction, deterioration or destruction.
6.5
Reliability and service life
The theoretical MTBF of the TQMa8XxS is approximately 610.860 h @ +40 °C ambient temperature, Ground, Benign.
The TQMa8XxS is designed to be insensitive to shock and vibration.
