Thermal Dynamics 51 CUTMASTER, Руководство по обслуживанию

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Manual 0-2972 5-5 REPLACEMENT PROCEDURES
6. The thermal pad, provided with the replacement
part, is a thin metal pad. Remove and discard any
loose protective paper coverings from the pad.
CAUTION
Protective coverings must be removed from the ther-
mal pad. Installing a thermal pad with protective
coverings in place will cause equipment damage or
failure.
7. Apply the round thermal pad to the heatsink with
a small piece of light-duty tape. Tape must cover
no more than 1/8” (3 mm) of the edge of the ther-
mal pad. Use the screw hole in the heatsink as a
guide to position the pad.
8. For IGBTs, remove the small jumpers from the com-
ponent being replaced. Transfer the jumpers to
the replacement component.
9. Clean the large flat surface on the back of the re-
placement component with isopropyl alcohol.
10. Install modules as follows:
a. Put the replacement module in position, and
secure with the screw removed previously. En-
sure that the washer is under the head of the
screw.
Diode
or IGBT
Round Thermal Pad
Washer Screw
Art # A-03907
Main PCB
Heatsink
Tape
b. Torque the screw to 17 inch-pounds (1.9 Nm).
CAUTION
Failure to torque properly will cause component
damage.
11. Reconnect the wiring per the applicable chart.
From IGBT
Terminals
To Main PCB
Terminals
E28, E29 E13
E32, E33 E15
E30,E31 E35
J18 J20
J19 J21
CutMaster 51
IGBT Wiring Connections
From Output
Diode
E38, E39
E42, E43
E36, E37
E40, E41
E18
E20
Output Diode Wiring Connections
To Main PCB
E21
E19
11. Stand the Power Supply upright. Re-connect pri-
mary input power, and test the unit per directions
in Section 4.10-G.
12. When all tests are completed, re-install the power
supply cover.