27
SWRS158B – FEBRUARY 2015 – REVISED JULY 2016
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Specifications
Copyright © 2015–2016, Texas Instruments Incorporated
DC Characteristics (continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
(1)
Each GPIO is referenced to a specific VDDS pin. See the technical reference manual listed in
for more details.
T
A
= 25°C, V
DDS
= 3.0 V
GPIO VOH at 8-mA load
IOCURR = 2, high-drive GPIOs only
2.68
V
GPIO VOL at 8-mA load
IOCURR = 2, high-drive GPIOs only
0.33
V
GPIO VOH at 4-mA load
IOCURR = 1
2.72
V
GPIO VOL at 4-mA load
IOCURR = 1
0.28
V
T
A
= 25°C, V
DDS
= 3.8 V
GPIO pullup current
Input mode, pullup enabled, Vpad = 0 V
277
µA
GPIO pulldown current
Input mode, pulldown enabled, Vpad = VDDS
113
µA
GPIO high/low input transition,
no hysteresis
IH = 0, transition between reading 0 and reading 1
1.67
V
GPIO low-to-high input transition,
with hysteresis
IH = 1, transition voltage for input read as 0
→
1
1.94
V
GPIO high-to-low input transition,
with hysteresis
IH = 1, transition voltage for input read as 1
→
0
1.54
V
GPIO input hysteresis
IH = 1, difference between 0
→
1 and 1
→
0 points
0.4
V
T
A
= 25°C
VIH
Lowest GPIO input voltage reliably interpreted as a
«High»
0.8
VDDS
(1)
VIL
Highest GPIO input voltage reliably interpreted as a
«Low»
0.2
VDDS
(1)
(1)
°C/W = degrees Celsius per watt.
(2)
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R
θ
JC
] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2,
Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
.
•
JESD51-3,
Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
.
•
JESD51-7,
High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
.
•
JESD51-9,
Test Boards for Area Array Surface Mount Package Thermal Measurements
.
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
5.26 Thermal Resistance Characteristics
NAME
DESCRIPTION
RSM (°C/W)
(1) (2)
RHB (°C/W)
(1) (2)
RGZ (°C/W)
(1) (2)
R
θ
JA
Junction-to-ambient thermal resistance
36.9
32.8
29.6
R
θ
JC(top)
Junction-to-case (top) thermal resistance
30.3
24.0
15.7
R
θ
JB
Junction-to-board thermal resistance
7.6
6.8
6.2
Psi
JT
Junction-to-top characterization parameter
0.4
0.3
0.3
Psi
JB
Junction-to-board characterization parameter
7.4
6.8
6.2
R
θ
JC(bot)
Junction-to-case (bottom) thermal resistance
2.1
1.9
1.9