background image

16

CC2650

SWRS158B – FEBRUARY 2015 – REVISED JULY 2016

www.ti.com

Submit Documentation Feedback

Product Folder Links:

CC2650

Specifications

Copyright © 2015–2016, Texas Instruments Incorporated

(1)

Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

5.7

1-Mbps GFSK (Bluetooth low energy Technology) – TX

Measured on the TI CC2650EM-5XD reference design with T

c

= 25°C, V

DDS

= 3.0 V, f

RF

= 2440 MHz, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Output power, highest setting

Differential mode, delivered to a single-ended 50-

Ω

load

through a balun

5

dBm

Output power, highest setting

Measured on CC2650EM-4XS, delivered to a single-ended
50-

Ω

load

2

dBm

Output power, lowest setting

Delivered to a single-ended 50-

Ω

load through a balun

–21

dBm

Spurious emission conducted
measurement

(1)

f < 1 GHz, outside restricted bands

–43

dBm

f < 1 GHz, restricted bands ETSI

–65

dBm

f < 1 GHz, restricted bands FCC

–76

dBm

f > 1 GHz, including harmonics

–46

dBm

(1)

Numbers given as I/C dB.

(2)

X / Y, where X is +N MHz and Y is –N MHz.

(3)

Excluding one exception at F

wanted

/ 2, per

Bluetooth

Specification.

5.8

2-Mbps GFSK (Bluetooth 5) – RX

Measured on the TI CC2650EM-5XD reference design with T

c

= 25°C, V

DDS

= 3.0 V, f

RF

= 2440 MHz, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Receiver sensitivity

Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10

–3

–92

dBm

Receiver saturation

Differential mode. Measured at the CC2650EM-5XD
SMA connector, BER = 10

–3

4

dBm

Frequency error tolerance

Difference between the incoming carrier frequency
and the internally generated carrier frequency

–300

500

kHz

Data rate error tolerance

Difference between incoming data rate and the
internally generated data rate

–1000

1000

ppm

Co-channel rejection

(1)

Wanted signal at –67 dBm, modulated interferer in
channel,
BER = 10

–3

–7

dB

Selectivity, ±2 MHz

(1)

Wanted signal at –67 dBm, modulated interferer at
±2 MHz, Image frequency is at -2 MHz
BER = 10

–3

8 / 4

(2)

dB

Selectivity, ±4 MHz

(1)

Wanted signal at –67 dBm, modulated interferer at
±4 MHz,
BER = 10

–3

31 / 26

(2)

dB

Selectivity, ±6 MHz

(1)

Wanted signal at –67 dBm, modulated interferer at
±6 MHz,
BER = 10

–3

37 / 38

(2)

dB

Alternate channel rejection, ±7
MHz

(1)

Wanted signal at –67 dBm, modulated interferer at

±7 MHz, BER = 10

–3

37 / 36

(2)

dB

Selectivity, Image frequency

(1)

Wanted signal at –67 dBm, modulated interferer at
image frequency,
BER = 10

–3

4

dB

Selectivity, Image frequency
±2 MHz

(1)

Note that Image fre 2 MHz is the Co-
channel. Wanted signal at –67 dBm, modulated
interferer at ±2 MHz from image frequency, BER =
10

–3

-7 / 26

(2)

dB

Out-of-band blocking

(3)

30 MHz to 2000 MHz

–33

dBm

Out-of-band blocking

2003 MHz to 2399 MHz

–15

dBm

Out-of-band blocking

2484 MHz to 2997 MHz

–12

dBm

Out-of-band blocking

3000 MHz to 12.75 GHz

–10

dBm

Intermodulation

Wanted signal at 2402 MHz, –64 dBm. Two
interferers at 2405 and 2408 MHz respectively, at
the given power level

–45

dBm

Содержание SimpleLink CC2650

Страница 1: ...28 Security Module True Random Number Generator TRNG 10 15 or 31 GPIOs Depending on Package Option Support for Eight Capacitive Sensing Buttons Integrated Temperature Sensor External System On Chip internal DC DC Converter Very Few External Components Seamless Integration With the SimpleLink CC2590 and CC2592 Range Extenders Pin Compatible With the SimpleLink CC13xx in 4 mm 4 mm and 5 mm 5 mm VQFN...

Страница 2: ...or operation on small coin cell batteries and in energy harvesting applications The CC2650 device contains a 32 bit ARM Cortex M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultralow power sensor controller This sensor controller is ideal for interfacing external sensors and for collecting analog and digital data autonomously while t...

Страница 3: ...r General peripherals modules 4 32 bit Timers 2 SSI SPI µW TI Watchdog timer Temp batt monitor RTC I2C UART I2S 10 15 31 GPIOs AES 32 ch µDMA ADC Digital PLL TRNG ADC 8KB cache Copyright 2016 Texas Instruments Incorporated 3 CC2650 www ti com SWRS158B FEBRUARY 2015 REVISED JULY 2016 Submit Documentation Feedback Product Folder Links CC2650 Device Overview Copyright 2015 2016 Texas Instruments Inco...

Страница 4: ...tor XOSC_LF 20 5 16 48 MHz RC Oscillator RCOSC_HF 21 5 17 32 kHz RC Oscillator RCOSC_LF 21 5 18 ADC Characteristics 21 5 19 Temperature Sensor 23 5 20 Battery Monitor 23 5 21 Continuous Time Comparator 23 5 22 Low Power Clocked Comparator 24 5 23 Programmable Current Source 24 5 24 Synchronous Serial Interface SSI 24 5 25 DC Characteristics 26 5 26 Thermal Resistance Characteristics 27 5 27 Timing...

Страница 5: ...the TX Current Consumption vs Supply Voltage VDDS graph 29 Changed Figure 5 14 Receive Mode Current vs Supply Voltage VDDS 29 Added Figure 5 24 Supply Current vs Temperature 31 Changes from February 21 2015 to October 15 2015 Page Removed RHB package option from CC2620 6 Added motional inductance recommendation to the 24 MHz XOSC table 20 Added SPI timing parameters 24 Added VOH and VOL min and ma...

Страница 6: ...ion The offerings range from fully customized solutions to turn key offerings with pre certified hardware and software protocol Sub 1 GHz Long range low power wireless connectivity solutions are offered in a wide range of Sub 1 GHz ISM bands Companion Products Review products that are frequently purchased or used in conjunction with this product SimpleLink CC2650 Wireless MCU LaunchPad Kit The CC2...

Страница 7: ...cuitry from this pin 4 Terminal Configuration and Functions 4 1 Pin Diagram RGZ Package Note I O pins marked in bold have high drive capabilities I O pins marked in italics have analog capabilities Figure 4 1 RGZ Package 48 Pin VQFN 7 mm 7 mm Pinout 0 5 mm Pitch 4 2 Signal Descriptions RGZ Package Table 4 1 Signal Descriptions RGZ Package NAME NO TYPE DESCRIPTION DCDC_SW 33 Power Output from inter...

Страница 8: ...igital Analog I O GPIO Sensor Controller Analog DIO_27 40 Digital Analog I O GPIO Sensor Controller Analog DIO_28 41 Digital Analog I O GPIO Sensor Controller Analog DIO_29 42 Digital Analog I O GPIO Sensor Controller Analog DIO_30 43 Digital Analog I O GPIO Sensor Controller Analog JTAG_TMSC 24 Digital I O JTAG TMSC high drive capability JTAG_TCKC 25 Digital I O JTAG TCKC RESET_N 35 Digital input...

Страница 9: ...s RHB Package NAME NO TYPE DESCRIPTION DCDC_SW 17 Power Output from internal DC DC 1 DCOUPL 12 Power 1 27 V regulated digital supply decoupling 2 DIO_0 6 Digital I O GPIO Sensor Controller DIO_1 7 Digital I O GPIO Sensor Controller DIO_2 8 Digital I O GPIO Sensor Controller high drive capability DIO_3 9 Digital I O GPIO Sensor Controller high drive capability DIO_4 10 Digital I O GPIO Sensor Contr...

Страница 10: ... LNA during RX Negative RF output signal to PA during TX RF_P 1 RF I O Positive RF input signal to LNA during RX Positive RF output signal to PA during TX RX_TX 3 RF I O Optional bias pin for the RF LNA VDDR 29 Power 1 7 V to 1 95 V supply typically connect to output of internal DC DC 3 2 VDDR_RF 32 Power 1 7 V to 1 95 V supply typically connect to output of internal DC DC 2 4 VDDS 28 Power 1 8 V ...

Страница 11: ...RIPTION DCDC_SW 18 Power Output from internal DC DC 1 Tie to ground for external regulator mode 1 7 V to 1 95 V operation DCOUPL 12 Power 1 27 V regulated digital supply decoupling capacitor 2 DIO_0 8 Digital I O GPIO Sensor Controller high drive capability DIO_1 9 Digital I O GPIO Sensor Controller high drive capability DIO_2 10 Digital I O GPIO Sensor Controller high drive capability DIO_3 15 Di...

Страница 12: ...l bias pin for the RF LNA VDDR 28 Power 1 7 V to 1 95 V supply typically connect to output of internal DC DC 2 3 VDDR_RF 32 Power 1 7 V to 1 95 V supply typically connect to output of internal DC DC 2 4 VDDS 27 Power 1 8 V to 3 8 V main chip supply 1 VDDS2 11 Power 1 8 V to 3 8 V GPIO supply 1 VDDS_DCDC 19 Power 1 8 V to 3 8 V DC DC supply Tie to ground for external regulator mode 1 7 V to 1 95 V ...

Страница 13: ...mode VDDS and VDDR pins connected on PCB 0 3 2 25 V Voltage on any digital pin 4 5 0 3 VDDSx 0 3 max 4 1 V Voltage on crystal oscillator pins X32K_Q1 X32K_Q2 X24M_N and X24M_P 0 3 VDDR 0 3 max 2 25 V Voltage on ADC input Vin Voltage scaling enabled 0 3 VDDS V Voltage scaling disabled internal reference 0 3 1 49 Voltage scaling disabled VDDS as reference 0 3 VDDS 2 9 Input RF level 5 dBm Tstg Stora...

Страница 14: ... 31 µA MHz Radio RX 1 5 9 mA Radio RX 2 6 1 Radio TX 0 dBm output power 1 6 1 Radio TX 5 dBm output power 2 9 1 Peripheral Current Consumption Adds to core current Icore for each peripheral unit activated 3 Iperi Peripheral power domain Delta current with domain enabled 20 µA Serial power domain Delta current with domain enabled 13 µA RF Core Delta current with power domain enabled clock enabled R...

Страница 15: ...MHz 1 Wanted signal at 67 dBm modulated interferer at 1 MHz BER 10 3 7 3 2 dB Selectivity 2 MHz 1 Wanted signal at 67 dBm modulated interferer at 2 MHz BER 10 3 34 25 2 dB Selectivity 3 MHz 1 Wanted signal at 67 dBm modulated interferer at 3 MHz BER 10 3 38 26 2 dB Selectivity 4 MHz 1 Wanted signal at 67 dBm modulated interferer at 4 MHz BER 10 3 42 29 2 dB Selectivity 5 MHz or more 1 Wanted signa...

Страница 16: ...eiver sensitivity Differential mode Measured at the CC2650EM 5XD SMA connector BER 10 3 92 dBm Receiver saturation Differential mode Measured at the CC2650EM 5XD SMA connector BER 10 3 4 dBm Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency 300 500 kHz Data rate error tolerance Difference between incoming data rate and the in...

Страница 17: ... noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity Differential mode Measured at the CC2650EM 5XD SMA connector BER 10 3 81 dBm Receiver saturation Differential mode Measured at the CC2650EM 5XD SMA connector BER 10 3 11 dBm Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency 300 300 kHz Data rate error tole...

Страница 18: ...c 25 C VDDS 3 0 V fRF 2440 MHz unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output power highest setting Differential mode delivered to a single ended 50 Ω load through a balun 5 dBm Output power highest setting Measured on CC2650EM 4XS delivered to a single ended 50 Ω load 2 dBm Output power lowest setting Delivered to a single ended 50 Ω load through a balun 21 dBm Occupied ...

Страница 19: ...d desensitization 5 MHz from lower band edge Wanted signal at 97 dBm 3 dB above the sensitivity level CW jammer PER 1 63 dB Blocking and desensitization 10 MHz from lower band edge Wanted signal at 97 dBm 3 dB above the sensitivity level CW jammer PER 1 63 dB Blocking and desensitization 20 MHz from lower band edge Wanted signal at 97 dBm 3 dB above the sensitivity level CW jammer PER 1 65 dB Bloc...

Страница 20: ... over temperature ageing and frequency pulling due to incorrect load capacitance As per Bluetooth and IEEE 802 15 4 specification 5 Kick started based on a temperature and aging compensated RCOSC_HF using precharge injection 5 14 24 MHz Crystal Oscillator XOSC_HF Tc 25 C VDDS 3 0 V unless otherwise noted 1 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ESR Equivalent series resistance 2 6 pF CL 9 pF 2...

Страница 21: ...e DNL typically varies from 0 3 to 3 5 depending on device see Figure 5 25 4 For a typical example see Figure 5 26 5 18 ADC Characteristics Tc 25 C VDDS 3 0 V and voltage scaling enabled unless otherwise noted 1 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input voltage range 0 VDDS V Resolution 12 Bits Sample rate 200 ksps Offset Internal 4 3 V equivalent reference 2 2 LSB Gain error Internal 4 3 V...

Страница 22: ...eference input voltage scaling enabled For best accuracy the ADC conversion should be initiated through the TIRTOS API in order to include the gain offset compensation factors stored in FCFG1 4 3 2 5 V Reference voltage Fixed internal reference input voltage scaling disabled For best accuracy the ADC conversion should be initiated through the TIRTOS API in order to include the gain offset compensa...

Страница 23: ...oltage coefficient 1 3 2 C V 5 20 Battery Monitor Measured on the TI CC2650EM 5XD reference design with Tc 25 C VDDS 3 0 V unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Resolution 50 mV Range 1 8 3 8 V Accuracy 13 mV 1 Additionally the bias module must be enabled when running in standby mode 5 21 Continuous Time Comparator Tc 25 C VDDS 3 0 V unless otherwise noted PARAMETER TES...

Страница 24: ...g in standby mode 5 23 Programmable Current Source Tc 25 C VDDS 3 0 V unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Current source programmable output range 0 25 20 µA Resolution 0 25 µA Current consumption 1 Including current source at maximum programmable output 23 µA 1 Refer to SSI timing diagrams Figure 5 1 Figure 5 2 and Figure 5 3 5 24 Synchronous Serial Interface SSI Tc ...

Страница 25: ...its 25 CC2650 www ti com SWRS158B FEBRUARY 2015 REVISED JULY 2016 Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instruments Incorporated Figure 5 1 SSI Timing for TI Frame Format FRF 01 Single Transfer Timing Measurement Figure 5 2 SSI Timing for MICROWIRE Frame Format FRF 10 Single Transfer ...

Страница 26: ...1 32 1 54 V GPIO VOL at 8 mA load IOCURR 2 high drive GPIOs only 0 26 0 32 V GPIO VOH at 4 mA load IOCURR 1 1 32 1 58 V GPIO VOL at 4 mA load IOCURR 1 0 21 0 32 V GPIO pullup current Input mode pullup enabled Vpad 0 V 71 7 µA GPIO pulldown current Input mode pulldown enabled Vpad VDDS 21 1 µA GPIO high low input transition no hysteresis IH 0 transition between reading 0 and reading 1 0 88 V GPIO l...

Страница 27: ...5 C VIH Lowest GPIO input voltage reliably interpreted as a High 0 8 VDDS 1 VIL Highest GPIO input voltage reliably interpreted as a Low 0 2 VDDS 1 1 C W degrees Celsius per watt 2 These values are based on a JEDEC defined 2S2P system with the exception of the Theta JC RθJC value which is based on a JEDEC defined 1S0P system and will change based on environment as well as application For more info...

Страница 28: ...ction 5 17 3 TA 40 C to 85 C VDDS 1 7 V to 3 8 V unless otherwise noted 5 27 Timing Requirements MIN NOM MAX UNIT Rising supply voltage slew rate 0 100 mV µs Falling supply voltage slew rate 0 20 mV µs Falling supply voltage slew rate with low power flash settings 1 3 mV µs Positive temperature gradient in standby 2 No limitation for negative temperature gradient or outside standby mode 5 C s CONT...

Страница 29: ...itivity dBm 40 30 20 10 0 10 20 30 40 50 60 70 80 99 98 97 96 95 94 Sensitivity 4XS Sensitivity 5XD Temperature qC Sensitivity dBm 40 30 20 10 0 10 20 30 40 50 60 70 80 103 102 101 100 99 98 97 96 95 Sensitivity 4XS Sensitivity 5XD 29 CC2650 www ti com SWRS158B FEBRUARY 2015 REVISED JULY 2016 Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instrum...

Страница 30: ...ng VDDS V Output power dBm 1 8 2 3 2 8 3 3 3 8 0 1 2 3 4 5 6 D003 5XD 5 dBm Setting 4XS 2 dBm Setting Temperature qC Output Power dBm 40 30 20 10 0 10 20 30 40 50 60 70 80 0 1 2 3 4 5 6 4XS 2 dBm Setting 5XD 5 dBm Setting 30 CC2650 SWRS158B FEBRUARY 2015 REVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instruments Incor...

Страница 31: ...e qC Active Mode Current Consumpstion mA 40 30 20 10 0 10 20 30 40 50 60 70 80 2 85 2 9 2 95 3 3 05 3 1 D006 Active Mode Current 31 CC2650 www ti com SWRS158B FEBRUARY 2015 REVISED JULY 2016 Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instruments Incorporated Typical Characteristics continued Figure 5 16 TX Mode Current Consumption vs Temperat...

Страница 32: ... Internal Reference No Averaging ENOB Internal Reference 32 Samples Averaging 32 CC2650 SWRS158B FEBRUARY 2015 REVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instruments Incorporated Typical Characteristics continued Figure 5 22 SoC ADC Output vs Temperature Fixed Input Internal Reference No Scaling Figure 5 23 SoC AD...

Страница 33: ...0 3200 3400 3600 3800 4000 4200 1 5 1 0 5 0 0 5 1 1 5 2 2 5 3 3 5 D010 33 CC2650 www ti com SWRS158B FEBRUARY 2015 REVISED JULY 2016 Submit Documentation Feedback Product Folder Links CC2650 Specifications Copyright 2015 2016 Texas Instruments Incorporated Typical Characteristics continued Figure 5 25 SoC ADC DNL vs ADC Code Internal Reference No Scaling Figure 5 26 SoC ADC INL vs ADC Code Interna...

Страница 34: ...modules 4 32 bit Timers 2 SSI SPI µW TI Watchdog timer Temp batt monitor RTC I2C UART I2S 10 15 31 GPIOs AES 32 ch µDMA ADC Digital PLL TRNG ADC 8KB cache Copyright 2016 Texas Instruments Incorporated 34 CC2650 SWRS158B FEBRUARY 2015 REVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Detailed Description Copyright 2015 2016 Texas Instruments Incorporated 6 Detai...

Страница 35: ...ta to be efficiently packed into memory Fast code execution permits slower processor clock or increases sleep mode time Harvard architecture characterized by separate buses for instruction and data Efficient processor core system and memories Hardware division and fast digital signal processing oriented multiply accumulate Saturating arithmetic for signal processing Deterministic high performance ...

Страница 36: ... provides application examples for some of these use cases but not for all of them The peripherals in the Sensor Controller include the following The low power clocked comparator can be used to wake the device from any state in which the comparator is active A configurable internal reference can be used in conjunction with the comparator The output of the comparator can also be used to trigger an ...

Страница 37: ...emory provides nonvolatile storage for code and data The flash memory is in system programmable The SRAM static RAM can be used for both storage of data and execution of code and is split into two 4 KB blocks and two 6 KB blocks Retention of the RAM contents in standby mode can be enabled or disabled individually for each block to minimize power consumption In addition if flash cache is disabled t...

Страница 38: ... Clock XOSC_LF or RCOSC_LF XOSC_LF or RCOSC_LF XOSC_LF or RCOSC_LF Off Off Peripherals Available Available Off Off Off Sensor Controller Available Available Available Off Off Wake up on RTC Available Available Available Off Off Wake up on Pin Edge Available Available Available Available Off Wake up on Reset Pin Available Available Available Available Available Brown Out Detector BOD Active Active ...

Страница 39: ...pherals to be assigned to I O pins in a flexible manner All digital I Os are interrupt and wake up capable have a programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge configurable When configured as an output pins can function as either push pull or open drain Five GPIOs have high drive capabilities marked in bold in Section 4 The SSIs are synchron...

Страница 40: ...ith software support the RTC can be used for clock and calendar operation The RTC is clocked from the 32 kHz RC oscillator or crystal The RTC can also be compensated to tick at the correct frequency even when the internal 32 kHz RC oscillator is used instead of a crystal The battery monitor and temperature sensor are accessible by software and give a battery status indication as well as a coarse t...

Страница 41: ...f the TI component specification and TI does not warrant its accuracy or completeness TI s customers are responsible for determining suitability of components for their purposes Customers should validate and test their design implementation to confirm system functionality 7 1 Application Information Very few external components are required for the operation of the CC2650 device This section provi...

Страница 42: ...RF P Pin 2 RF N 24 MHz XTAL Load Caps on Chip VDDS_DCDC Pin CC26xx 2 2 F DCDC_SW Pin 1 7 V 1 95 V to All VDDR and VDDS Pins Except VDDS_DCDC Ext Regulator Copyright 2016 Texas Instruments Incorporated 42 CC2650 SWRS158B FEBRUARY 2015 REVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Application Implementation and Layout Copyright 2015 2016 Texas Instruments Inc...

Страница 43: ...1 1 pF C21 1 pF C20 100 nF X24M_N X24M_P VDDS VDDR DCDC_SW DCDC_SW C31 6 8 pF VDDS nRESET C19 1 µF JTAG_TCK JTAG_TMS DIO_1 DIO_0 DIO_3 DIO_2 DIO_5 JTAG_TDO DIO_4 DIO_7 DIO_6 JTAG_TDI DIO_10 DIO_9 DIO_8 DIO_12 DIO_11 DIO_14 DIO_13 RX_TX RFP RFN L11 2 7 nH 1 2 L21 2 4 nH 1 2 VDD_EB FL1 BLM18HE152SN1 1 2 C9 100 nF C3 100 nF C4 100 nF VDDS Decoupling Capacitors Pin 18 Pin 28 Pin 11 C7 100 nF L10 6 2 n...

Страница 44: ...EVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Application Implementation and Layout Copyright 2015 2016 Texas Instruments Incorporated 7 2 1 Layout Figure 7 4 5 5 External Differential 5XD Layout ...

Страница 45: ...0 8 DIO_1 9 DIO_2 10 DIO_3 15 DIO_4 16 DIO_5 22 DIO_6 23 DIO_7 24 DIO_8 25 DIO_9 26 RESET_N 21 JTAG_TCKC 14 JTAG_TMSC 13 X24M_P 31 X24M_N 30 DCOUPL 12 VSS 29 VSS 3 EGP 33 VDDS 27 VDDS2 11 VDDS_DCDC 19 VDDR 28 VDDR 32 DCDC_SW 18 RX TX 4 RF_N RF_P 1 X32K_Q2 6 X32K_Q1 5 VSS 7 VSS 17 VSS 20 DIO_1 DIO_3 JTAG_TDO DIO_2 DIO_6 DIO_5 DIO_4 JTAG_TDI DCDC_SW JTAG_TCK nRESET JTAG_TMS C23 DNM C22 DNM X24M_N X2...

Страница 46: ...EVISED JULY 2016 www ti com Submit Documentation Feedback Product Folder Links CC2650 Application Implementation and Layout Copyright 2015 2016 Texas Instruments Incorporated 7 3 1 Layout Figure 7 6 4 4 External Single ended 4XS Layout ...

Страница 47: ...w X Experimental device that is not necessarily representative of the final device s electrical specifications and may not use production assembly flow P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications null Production version of the silicon die that is fully qualified Production devices have been characterized fully and th...

Страница 48: ... the CC26xx which can perform simple background tasks autonomously and independent of the System CPU state Allows for Sensor Controller task algorithms to be implemented using a C like programming language Outputs a Sensor Controller Interface driver which incorporates the generated Sensor Controller machine code and associated definitions Allows for rapid development by using the integrated Senso...

Страница 49: ... 8 6 Community Resources The following links connect to TI community resources Linked contents are provided AS IS by the respective contributors They do not constitute TI specifications and do not necessarily reflect TI s views see TI s Terms of Use TI E2E Online Community TI s Engineer to Engineer E2E Community Created to foster collaboration among engineers At e2e ti com you can ask questions sh...

Страница 50: ...itute of Electrical and Electronics Engineers Incorporated ZigBee is a registered trademark of ZigBee Alliance Inc All other trademarks are the property of their respective owners 8 9 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD Texas Instruments recommends that all integrated circuits be handled with appropriate precautions Failure to observe proper handling and i...

Страница 51: ... planned eco friendly classification Pb Free RoHS Pb Free RoHS Exempt or Green RoHS no Sb Br please check http www ti com productcontent for the latest availability information and additional product content details TBD The Pb Free Green conversion plan has not been defined Pb Free RoHS TI s terms Lead Free or Pb Free mean semiconductor products that are compatible with the current RoHS requiremen...

Страница 52: ...third parties and makes no representation or warranty as to the accuracy of such information Efforts are underway to better integrate information from third parties TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals TI and TI suppliers consider...

Страница 53: ... 1 12 0 16 0 Q2 CC2650F128RGZT VQFN RGZ 48 250 180 0 16 4 7 3 7 3 1 1 12 0 16 0 Q2 CC2650F128RHBR VQFN RHB 32 3000 330 0 12 4 5 3 5 3 1 1 8 0 12 0 Q2 CC2650F128RHBT VQFN RHB 32 250 180 0 12 4 5 3 5 3 1 1 8 0 12 0 Q2 CC2650F128RSMR VQFN RSM 32 3000 330 0 12 4 4 25 4 25 1 15 8 0 12 0 Q2 CC2650F128RSMT VQFN RSM 32 250 180 0 12 4 4 25 4 25 1 15 8 0 12 0 Q2 PACKAGE MATERIALS INFORMATION www ti com 30 N...

Страница 54: ... 367 0 367 0 38 0 CC2650F128RGZT VQFN RGZ 48 250 210 0 185 0 35 0 CC2650F128RHBR VQFN RHB 32 3000 367 0 367 0 35 0 CC2650F128RHBT VQFN RHB 32 250 210 0 185 0 35 0 CC2650F128RSMR VQFN RSM 32 3000 367 0 367 0 35 0 CC2650F128RSMT VQFN RSM 32 250 210 0 185 0 35 0 PACKAGE MATERIALS INFORMATION www ti com 30 Nov 2015 Pack Materials Page 2 ...

Страница 55: ......

Страница 56: ......

Страница 57: ......

Страница 58: ......

Страница 59: ......

Страница 60: ......

Страница 61: ......

Страница 62: ......

Страница 63: ......

Страница 64: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

Страница 65: ...o the CC2650 Datasheet for additional details NOTE Some LaunchPads BoosterPacks do not comply 100 with the standard so please check your specific LaunchPad to ensure pin compatibility For information about pins and compability please go to dev ti com bpchecker Timer Capture Timer Capture GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO SPI CS Wireless SPI CS Display SPI CS Other GND GPIO GPIO GPI...

Страница 66: ... 0 For rev 1 1 of the LaunchPad only Go to dev ti com launchxl cc2650 and upgrade the firmware via USB before using the LaunchPad with the Simplelink Starter app Ready to Learn More Documentation TI RTOS Drivers Bluetooth Smart Code Examples Application Notes Design Files and more CC2650 Launchpad Overview dev ti com launchxl cc2650 A closer look at your new LaunchPad Development Kit Featured wire...

Страница 67: ...ring the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty If TI elects to repair or replace such EVM TI shall have a reasonable time to repair such EVM or provide replacements Repaired EVMs shall be warranted for the remainder of the original warranty period Replaced EVMs shall be warranted for a new full ninety 90 day warranty period 3 ...

Страница 68: ... by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Concernant les EVMs avec antennes détachables Conformément à la rég...

Страница 69: ... connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation even with the inputs and outputs kept within the specified allowable ranges some circuit components may have elevated case temperatures These components include but are not limited to linear regulators switching transistors pass transistors cu...

Страница 70: ...F REMOVAL OR REINSTALLATION ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES RETESTING OUTSIDE COMPUTER TIME LABOR COSTS LOSS OF GOODWILL LOSS OF PROFITS LOSS OF SAVINGS LOSS OF USE LOSS OF DATA OR BUSINESS INTERRUPTION NO CLAIM SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED 8 2 Specific Limitations IN NO EVENT SHALL T...

Страница 71: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

Отзывы: