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Solder paste applied

No solder paste applied

Cross-Hatching – Recommended

No Cross-Hatching – Not Recommended

2.1.5

Recommended Solder Paste

2.2

Additional Information

Board Layout

Figure 10. Thermal Pad Stencil Opening

TI recommends the use of type 3 or finer solder paste when mounting a QFN.

For detailed information on the QFN package including thermal modeling considerations and repair
procedures, see (

SLUA271

) QFN/SON PCB attachment.

QFN Layout Guidelines

SLOA122 – July 2006

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Содержание QFN Layout

Страница 1: ...r use this information for optimal designs The QFN package is a thermally enhanced standard size IC package designed to eliminate the use of bulky heat sinks and slugs This package can be easily mount...

Страница 2: ...der mask The recommended dimensions are shown in Figure 3 Figure 3 Finger Pads Layout The solder mask defined thermal pad is the exposed copper area not covered by solder mask It must be soldered dire...

Страница 3: ...top copper layer of the PCB to the inner or bottom copper layers TI provides the recommended layout of the thermal vias in most data sheets The recommended via diameter is 0 3 mm or less and the recom...

Страница 4: ...thermal pad to help dissipate heat through bottom or inner planes If thin PCBs or vias larger than 0 3 mm are used designers may use only external vias to prevent solder loss and protrusions see Figur...

Страница 5: ...gs and thickness recommended to ensure that the right amount of solder paste is used Figure 9 Recommended Stencil Openings and Thickness for RGZ Package Use cross hatching in the thermal pad stencil o...

Страница 6: ...ional Information Board Layout Figure 10 Thermal Pad Stencil Opening TI recommends the use of type 3 or finer solder paste when mounting a QFN For detailed information on the QFN package including the...

Страница 7: ...m TI to use such products or services or a warranty or endorsement thereof Use of such information may require a license from a third party under the patents or other intellectual property of the thir...