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2
Board Layout
Solder Mask Defined Thermal Pad, see Figure 4
Finger Pads, see Figure 3
2.1
Solder Mask Defined Thermal Pad
2.1.1
Copper Areas
Board Layout
Figure 2
shows an example of the recommended board layout for an RGZ package.
Figure 2. Board Layout for an RGZ Package Finger Pads
TI recommends the use of rounded finger pads to prevent solder bridging. Surround each pad with a
0,07-mm wide solder mask. The recommended dimensions are shown in
Figure 3
.
Figure 3. Finger Pads Layout
The solder mask defined thermal pad is the exposed copper area not covered by solder mask. It must be
soldered directly to the thermal pad on the bottom of the IC.
Figure 2
shows an example of the
recommended dimensions.
Copper areas on and in a PCB act as heat sinks for the QFN device. Top copper areas should be covered
with solder mask leaving only the solder mask defined thermal pad exposed. The top copper areas should
be made as large as possible.
2
QFN Layout Guidelines
SLOA122 – July 2006
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