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Protrusion
2.1.4
Stencil
Board Layout
Figure 8. Protrusion at the Other Side of Board
Figure 9
shows an example of the recommended stencil openings and thickness. Follow stencil openings
and thickness recommended to ensure that the right amount of solder paste is used.
Figure 9. Recommended Stencil Openings and Thickness for RGZ Package
Use cross-hatching in the thermal pad stencil opening of a QFN device. This prevents excessive amount
of solder paste applied thus prevents solder bridging (see
Figure 10
).
SLOA122 – July 2006
QFN Layout Guidelines
5
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