2.1.2 Power Pins
There are some high frequency decoupling capacitors on the LMG352XEVM-04X from VDC to PGND to
minimize voltage overshoot during switching, but more bulk capacitance is required to hold up the DC voltage
during operation. TI recommends preventing any overlap and parasitic capacitance from VSW to VDC, PGND,
and any logic pins. The two ground PGND and AGND pins are functionally isolated from each other on the
LMG352XEVM-04X.
2.1.3 Bootstrap Mode
The LMG352XEVM-04X card can be modified to operate in bootstrap mode, where the 12-V bias voltage is used
to power both LMG352XR0X0 devices. This can be achieved by the following modifications to the EVM:
1. Remove R1.
2. Place a 2-Ω resistor on R2.
3. Place a 650-V SMB diode on D1, such as GB01SLT06-214.
4. Adjust Rdrv resistor for the low side to be above 400 kΩ, which corresponds to a slew rate below 30 V/ns for
the low side.
2.1.4 Heat Sink
The heat sink is installed to help with heat dissipation of the LMG352XR0X0. Exposed top-side thermal pads on
device package are attached to heat sink with thermal interface material (TIM) pressed in between, providing a
low thermal impedance path. The two exposed copper pads have a high-voltage potential difference between
them, therefore an electrically isolated TIM with sufficient dielectric strength is required.
Figure 2-2. Front Side View of the EVM
Figure 2-3. Back Side View of the EVM
Introduction
SNOU178A – OCTOBER 2020 – REVISED FEBRUARY 2021
LMG352XEVM-04X User Guide
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