Texas Instruments DAC8580, Руководство пользователя

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PCB Design and Performance
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analyze the component placement and carefully split the board into its analog and digital sections starting
from the device under test. The ground plane plays an important role in controlling the noise and other
effects that otherwise contribute to the error of the DAC output. To ensure that the return currents are
handled properly, route the appropriate signals only in their respective sections, meaning the analog
traces should only lay directly above or below the analog section and the digital traces in the digital
section. Minimize the length of the traces but use the biggest possible trace width allowable in the design.
These design practices can be seen in
Figure 2 through Figure 7 .
The DAC8580/81EVM board is constructed on a four-layer printed-circuit board (PCB) using a copper-clad
FR-4 laminate material. The PCB has a dimension of 43,1800 mm (1.7000 inch) × 82,5500 mm (3.2000
inch), and the board thickness is 1,5748 mm (0.0620 inch).
Figure 2 through Figure 7 show the individual
artwork layers.
Figure 2. Top Silkscreen
Figure 3. Layer 1 (Top Signal Plane)
4 DAC8580/81 Evaluation Module SLAU173A – December 2005 – Revised November 2009
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